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  • CTML1206-R33M

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    ## CTML1206-R33M: Electronic Component Specifications The **CTML1206-R33M** is a surface-mount (SMD) multilayer chip inductor. It is widely used in power management and signal filtering applications within compact electronic devices. --- ### 1. Part Number Breakdown Understanding the nomenclature helps identify its physical and electrical characteristics: | Code | Segment | Meaning | | :--- | :--- | :--- | | **CTML** | Series | Multilayer Chip Inductor (Ferrite Core) | | **1206** | Case Size | 3.2mm x 1.6mm (Imperial 1206) | | **R33** | Inductance | 0.33 µH (Microhenries) | | **M** | Tolerance | ±20% | --- ### 2. Technical Specifications Below are the typical electrical parameters for this specific component: | Parameter | Value | | :--- | :--- | | **Inductance** | 0.33 µH | | **Tolerance** | ±20% | | **DC Resistance (DCR)** | ~0.15 - 0.25 Ω (Max) | | **Rated Current (Idc)** | ~250 mA - 400 mA | | **Self-Resonant Frequency (SRF)** | >100 MHz | | **Operating Temperature** | -55°C to +125°C | | **Core Material** | Ferrite | --- ### 3. Key Features and Applications The multilayer construction offers specific advantages over wire-wound inductors: * **Magnetic Shielding:** The multilayer ferrite structure provides a closed magnetic circuit, minimizing electromagnetic interference (EMI) and crosstalk with neighboring components. * **High Reliability:** The monolithic structure is highly resistant to mechanical shock and vibration. * **Compact Design:** The 1206 footprint allows for high-density PCB layouts. #### Common Uses: 1. **Noise Suppression:** Used in DC-to-DC converters to filter out high-frequency noise. 2. **Signal Conditioning:** Decoupling and filtering in communication equipment (Bluetooth, Wi-Fi modules). 3. **Consumer Electronics:** Found in smartphones, tablets, and wearable devices where space is limited. --- ### 4. PCB Footprint (1206 Metric 3216) ```text Dimensions (Approximate): L: 3.2mm ± 0.2mm W: 1.6mm ± 0.2mm T: 1.1mm ± 0.2mm ```
    ✨ Follow-up Questions
    • What is the difference between multilayer and wire-wound inductors?
    • Can this inductor be used for high-current power applications?
    • What are the recommended soldering profiles for 1206 SMD components?