The **DFE252012P-R68M** is a high-performance, miniature power inductor manufactured by Murata Electronics. It belongs to the DFE series, which utilizes a metal alloy core technology designed for high-current applications in compact electronic devices. --- ### 1. Technical Specifications Below are the primary electrical and physical characteristics of the component: | Parameter | Specification | | :--- | :--- | | **Inductance** | 0.68 µH | | **Tolerance** | ±20% (M) | | **DC Resistance (Max)** | 31 mΩ | | **Rated Current (Isat)** | 4.8 A (Based on Inductance change) | | **Rated Current (Itemp)** | 3.8 A (Based on Temperature rise) | | **Operating Temperature** | -40°C to +125°C | | **Dimensions (LxWxH)** | 2.5 x 2.0 x 1.2 mm | | **Core Material** | Metal Alloy (Magnetic Iron Powder) | --- ### 2. Part Number Breakdown The nomenclature reveals specific details about the part's physical and electrical build: * **DFE**: Series Name (Metal alloy core, wound type). * **2520**: Dimensions in millimeters (2.5mm x 2.0mm). * **12**: Maximum height (1.2mm). * **P**: Internal manufacturing code/Structure. * **R68**: Inductance value (R68 = 0.68 µH). * **M**: Tolerance (M = ±20%). --- ### 3. Key Features and Advantages The DFE series is engineered to solve common issues found in traditional ferrite inductors: * **High Current Handling:** The metal alloy core allows for a "Soft Saturation" characteristic, meaning the inductance drops gradually as current increases rather than dropping sharply. * **Low DC Resistance (RDC):** The internal structure minimizes energy loss, which improves battery life and reduces heat generation in mobile devices. * **Low Acoustic Noise:** The molded construction reduces magnetic flux leakage and physical vibration, making it quieter than traditional wire-wound inductors. * **Magnetic Shielding:** The design is inherently shielded, reducing Electromagnetic Interference (EMI) with surrounding components. --- ### 4. Typical Applications Due to its small footprint and high efficiency, this inductor is commonly found in: 1. **Smartphones and Tablets:** In DC-DC converter circuits for CPU/GPU power. 2. **Wearables:** In power management units (PMICs) for smartwatches. 3. **SSD/Portable Storage:** Power rails requiring high stability in small form factors. 4. **IoT Devices:** Where space is at a premium and high efficiency is required.