## DFP201612NF-R56M: Electronic Component Analysis The **DFP201612NF-R56M** is a high-performance **Wire-Wound Surface Mount (SMD) Power Inductor**, typically manufactured by companies like Cyntec or Delta. These components are designed for high-density power applications such as DC-DC converters in smartphones and wearables. --- ### 1. Part Number Breakdown The alphanumeric code provides specific technical details about the component's physical and electrical characteristics: | Code Segment | Meaning | Specification | | :--- | :--- | :--- | | **DFP** | Series Name | Metal alloy core, wire-wound type | | **2016** | Dimensions (Metric) | 2.0 mm x 1.6 mm | | **12** | Height | 1.2 mm maximum | | **NF** | Internal Code | Material/Process identifier | | **R56** | Inductance Value | 0.56 µH (Microhenries) | | **M** | Tolerance | ±20% | --- ### 2. Technical Specifications Inductors in this series are known for their high saturation current and low DC resistance (DCR). * **Inductance:** 0.56 µH * **Operating Temperature:** -40°C to +125°C (includes self-heating) * **Material:** Metal Powder Core (allows for "soft saturation" characteristics) * **Shielding:** Magnetic Resin shielded (reduces EMI) #### Estimated Electrical Ratings *Typical values for this specific footprint:* * **Isat (Saturation Current):** ~4.0A - 5.5A (Current where inductance drops by 30%) * **Irms (Rated Current):** ~3.5A - 4.5A (Current causing 40°C temperature rise) * **DCR (DC Resistance):** ~20mΩ - 30mΩ --- ### 3. Key Features & Applications #### Features 1. **Low Profile:** The 1.2mm height is ideal for thin consumer electronics. 2. **Metal Alloy Core:** Provides superior saturation current performance compared to traditional ferrite inductors. 3. **Efficiency:** Optimized for low DCR to minimize power loss during high-current operations. #### Typical Applications * **Power Management Units (PMICs):** Used in buck/boost converters. * **Mobile Devices:** Smartphones, tablets, and smartwatches. * **SSD Storage:** Voltage regulation for high-speed NAND memory. * **IoT Devices:** Compact power modules for sensors and connectivity. --- ### 4. Footprint and Mounting The **2016 (0806)** package size refers to the footprint on the PCB: * **Length:** 2.0 ± 0.2 mm * **Width:** 1.6 ± 0.2 mm * **Terminals:** Lead-free plating, compatible with standard Reflow Soldering processes.