The **DFP201612NF-R68M** is a high-performance, surface-mount (SMD) power inductor. It is specifically designed for high-density power supply circuits, such as DC-DC converters found in mobile devices and compact electronics. ### 1. Part Number Breakdown Understanding the nomenclature helps identify the physical and electrical characteristics: | Code Segment | Meaning | Description | | :--- | :--- | :--- | | **DFP** | Series Prefix | Metal alloy core power inductor series | | **2016** | Dimensions (Metric) | 2.0 mm x 1.6 mm footprint | | **12** | Height | 1.2 mm maximum thickness | | **NF** | Material/Process | Specific core material and internal designator | | **R68** | Inductance Value | 0.68 µH (Microhenries) | | **M** | Tolerance | ±20% | --- ### 2. Key Technical Specifications Based on standard industry data for this component class: | Parameter | Typical Value | | :--- | :--- | | **Inductance** | 0.68 µH | | **DC Resistance (DCR)** | ~35 - 45 mΩ (Max) | | **Rated Current (Isat)** | ~4.0 A - 4.5 A (Saturation) | | **Rated Current (Irms)** | ~3.0 A - 3.5 A (Temperature Rise) | | **Operating Temperature** | -40°C to +125°C | | **Core Material** | Metal Alloy (Metal Composite) | --- ### 3. Core Characteristics & Benefits The "Metal Alloy" construction provides several advantages over traditional ferrite inductors: * **Soft Saturation:** Unlike ferrite, which loses inductance abruptly when current limits are exceeded, metal alloy cores show a gradual drop in inductance. This prevents sudden spikes in circuit current. * **Low Magnetic Leakage:** The molded construction acts as a magnetic shield, reducing electromagnetic interference (EMI) with neighboring components. * **High Current Density:** The 2016 size is extremely small, but the alloy material allows it to handle much higher currents than traditional wire-wound or ferrite-core chips of the same size. ### 4. Common Applications * **Smartphones & Tablets:** Power management units (PMIC). * **Wearables:** Compact DC-DC conversion for battery-operated devices. * **SSD/Storage:** Voltage regulation for high-speed data components. * **IoT Modules:** High-efficiency power stages in constrained spaces. --- ### 5. Land Pattern (Suggested Footprint) ```markdown Typical Solder Pad Dimensions (mm): - Width (W): 1.6 mm - Pad Length (L1): 0.7 mm - Gap (G): 0.8 mm ```