The part number **F2VF-GD-R** refers to a high-speed, high-density mezzanine connector manufactured by **Samtec**. It is part of the **SEARAY™** (SEAM/SEAF Series) family, specifically designed for high-speed board-to-board applications. --- ## 1. Component Specifications The following table highlights the core technical characteristics of the F2VF-GD-R series: | Feature | Specification | | :--- | :--- | | **Series** | SEARAY™ High-Speed Mezzanine | | **Pitch** | 1.27 mm (.050") | | **Mounting Type** | Surface Mount (SMT) | | **Impedance** | 50 Ω (Single-ended) / 100 Ω (Differential Pair) | | **Data Rate** | Up to 28 Gbps | | **Contact Material** | Copper Alloy | | **Plating** | Gold (G) in contact area, Tin on tail | --- ## 2. Part Number Breakdown Understanding the nomenclature helps identify the specific configuration of the connector: ### **F2VF** This identifies the specific series (Female Vertical) within the high-density family. It is often a specialized variant of the **SEAF** series. ### **-GD** * **G:** Gold plating (typically 10µ" or 30µ" depending on sub-specs) to ensure low contact resistance and corrosion protection. * **D:** Denotes the number of rows or a specific differential pair layout configuration. ### **-R** * **R:** Tape and Reel packaging. This indicates the part is prepared for automated pick-and-place assembly machines. --- ## 3. Key Technical Features * **High Pin Density:** The SEARAY system allows for up to 500+ I/Os in a very small footprint. * **Solder Charge Technology:** These connectors utilize Samtec’s "Solder Charge" leads, which simplify the SMT reflow process and increase joint reliability compared to standard BGA (Ball Grid Array) solder balls. * **Low Insertion Force:** The contacts are designed to reduce the force required to mate the boards, preventing damage to the PCB during assembly. * **Versatile Stacking:** By pairing the **F2VF** (Female) with different **SEAM** (Male) heights, engineers can achieve various "stack heights" ranging from 7mm to 40mm. --- ## 4. Common Applications Due to its high bandwidth and reliability, this part is typically used in: 1. **Networking & Telecom:** High-speed routers and switches. 2. **Medical Imaging:** Data-intensive equipment like MRI and CT scanners. 3. **Military/Aerospace:** Ruggedized computing modules. 4. **Test & Measurement:** High-frequency oscilloscopes and signal generators.