The **FI-R series** is a high-performance connector line developed by **JAE (Japan Aviation Electronics)**. It is specifically engineered for high-speed serial digital transmission, commonly used to connect internal components in high-definition displays. --- ### 1. Key Technical Specifications The FI-R series is designed to handle high data rates while maintaining a slim profile suitable for modern thin-panel electronics. | Feature | Specification | |:---|:---| | **Pitch** | 0.50 mm | | **Data Rate** | Supports LVDS, CML, and V-by-One HS | | **Number of Contacts** | 21, 31, 41, or 51 positions | | **Impedance** | 100 Ohm differential matching | | **Rated Current** | 0.7 A per contact | | **Operating Temperature** | -40°C to +80°C | --- ### 2. Main Components of the FI-R System The system consists of three primary electronic parts that work together to ensure signal integrity: #### A. The Plug (Cable Side) - **FI-RE (Housing):** The plastic shell that holds the crimp terminals. - **FI-RC (Crimp Contact):** The gold-plated metal pins that are crimped onto wires (usually 30 to 36 AWG). - **FI-RE-S (Shell):** A metal cover that provides EMI/EMC shielding and structural rigidity. #### B. The Receptacle (Board Side) - **FI-RE-CL:** A surface-mount (SMT) connector soldered onto the PCB. - It features a mechanical lock to prevent accidental disconnection caused by vibration. #### C. The Cable (Transmission Line) - Typically uses **Thin-wire Coaxial cable** or **Shielded Twisted Pair (STP)** to ensure high-speed data transmission without interference. --- ### 3. Applications and Usage Because of its high-speed capabilities and compact 0.5mm pitch, the FI-R series is the industry standard for: * **LCD/LED Panels:** Connecting the main processing board to the T-CON (Timing Controller). * **High-Definition TVs:** Handling 4K/8K video signals via V-by-One HS protocols. * **Medical Imaging:** Used in high-resolution diagnostic monitors. * **Industrial Displays:** Found in ruggedized human-machine interfaces (HMI). --- ### 4. Comparison: FI-R vs. FI-X | Feature | FI-R Series | FI-X Series | |:---|:---|:---| | **Pitch** | 0.5 mm (Smaller) | 1.0 mm (Larger) | | **Speed** | High-speed (V-by-One HS) | Standard LVDS | | **Size** | Ultra-slim | Standard thin |