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  • FP0805R1-R06-R

  • AI
    The **FP0805R1-R06-R** is a high-current, shielded drum core power inductor commonly used in voltage regulator modules (VRMs) and high-density power applications. It is manufactured by Eaton (formerly Cooper Bussmann/Coiltronics). ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Inductance** | 60 nH (0.06 µH) | | **Tolerance** | ±10% | | **Current Rating (Irms)** | 61 Amperes | | **Saturation Current (Isat)** | 85 Amperes (@ 25°C) | | **DC Resistance (DCR)** | 0.17 mΩ (Typical) | | **Package / Case** | 0805 (Metric: 8.0 x 5.0 x 5.0 mm) | | **Operating Temperature** | -40°C to +125°C | --- ### Key Features and Construction 1. **High Current Density:** Designed to handle very high saturation currents (up to 85A) in a compact 8.0mm x 5.0mm footprint. 2. **Low DCR:** The extremely low DC resistance (0.17 mΩ) minimizes power loss and improves efficiency in high-frequency switching power supplies. 3. **Ferrite Core Material:** Utilizes a ferrite material that provides low core losses at high frequencies, making it ideal for multi-phase buck converters. 4. **SMD Design:** Surface-mount technology allows for automated pick-and-place assembly. ### Common Applications * **Computing:** Multi-phase regulators for CPUs (Central Processing Units) and GPUs (Graphics Processing Units). * **Networking:** High-current DC-DC converters for routers and switches. * **Voltage Regulator Modules (VRM):** Specifically designed for point-of-load (POL) converters. * **Data Centers:** Power distribution for servers and high-speed data storage systems. --- ### Part Number Breakdown `FP0805R1-R06-R` * **FP:** Series Prefix (Flat-Pac inductor). * **0805:** Physical Dimensions (Approx. 8.0mm x 5.0mm). * **R1:** Version/Revision code. * **R06:** Inductance value (R06 = 0.06 µH or 60 nH). * **-R:** RoHS compliant suffix.
    ✨ Follow-up Questions
    • What is the difference between Irms and Isat for this inductor?
    • Can this inductor be used in high-frequency switching above 1MHz?
    • What are the recommended footprint dimensions for soldering?