FP1005R4-R12-R
AI

The **FP1005R4-R12-R** is a high-performance, high-current power inductor typically used in multi-phase voltage regulator modules (VRMs). It belongs to the Eaton (formerly Cooper Bussmann/Coiltronics) **FP1005** series.
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### 1. Technical Specifications
The part number reveals the specific electrical characteristics of the component:
| Parameter | Specification |
| :--- | :--- |
| **Inductance (L)** | 120 nH (0.12 µH) |
| **Tolerance** | ±10% |
| **Full Load Current ($I_{sat}$)** | ~53 Amps (at 25°C) |
| **DCR (Direct Current Resistance)** | 0.29 mΩ (Typical) |
| **Frequency Range** | Up to 2 MHz |
| **Dimensions** | 10.2 x 7.0 x 4.95 mm |
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### 2. Breakdown of the Part Number
The nomenclature follows a specific logic used by the manufacturer:
* **FP1005:** Series name (Flat-Pac), where numbers represent the physical size (approx. 10mm x 5mm footprint).
* **R4:** Indicates the version or revision (Version 4).
* **R12:** Represents the inductance value. `R` denotes the decimal point (0.12 µH).
* **-R:** Indicates RoHS compliance.
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### 3. Key Design Features
* **Ferrite Core Material:** Provides low core losses at high switching frequencies, making it ideal for high-efficiency DC-DC converters.
* **Vertical Mounting:** The design uses a "Flat-Pac" structure with a small footprint to save PCB real estate.
* **High Saturation Current:** It is designed to handle very high current spikes without the inductance dropping significantly (magnetic saturation).
* **Low DCR:** The use of flat wire or specialized winding ensures extremely low resistance, reducing heat generation and power waste.
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### 4. Common Applications
This inductor is specifically engineered for high-density power environments:
1. **Server & Networking:** Voltage regulators for CPUs, GPUs, and ASICs.
2. **Graphics Cards:** High-end GPU power delivery stages.
3. **Data Centers:** Distributed power systems and point-of-load (POL) converters.
4. **Desktop Computing:** Vcore power modules for high-performance motherboards.
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### 5. Footprint/Layout Example
When designing a PCB for this part, the landing patterns usually look like this:
```markdown
[PAD 1] --- 2.54mm --- [PAD 2]
| |
|--- Body: 10.2mm L -----|
```
- ⤷What are the cooling requirements for the FP1005R4 at maximum current?
- ⤷ How does the R12 compare to the R22 version in the same series?
- ⤷ What is the typical thermal derating curve for this inductor?