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  • FP1008L2-R150-R

  • AI
    ### Technical Overview: FP1008L2-R150-R The **FP1008L2-R150-R** is a high-current, flat-pac power inductor typically manufactured by **Eaton (formerly Cooper Bussmann/Coiltronics)**. It is specifically designed for high-frequency, high-current power applications such as multi-phase VRMs (Voltage Regulator Modules) and DC-DC converters. --- ### Key Specifications | Parameter | Value / Description | | :--- | :--- | | **Inductance (L)** | 150 nH (0.150 µH) | | **Tolerance** | ±10% | | **Saturation Current ($I_{sat}$)** | ~72 Amperes | | **RMS Current ($I_{rms}$)** | ~53 Amperes | | **DCR (DC Resistance)** | 0.17 mΩ (typical) | | **Operating Temperature** | -40°C to +125°C | | **Package / Case** | 10.2 x 8.0 x 8.0 mm (Flat-Pac) | --- ### Critical Electronic Characteristics #### 1. Low Core Loss The inductor utilizes a specialized ferrite core material designed to minimize energy loss during high-frequency switching (MHz range). This is essential for maintaining efficiency in power-dense environments like servers and workstations. #### 2. High Saturation Current ($I_{sat}$) With a saturation current of approximately **72A**, this component can handle massive surges in current without the inductance dropping significantly. This ensures stable power delivery to high-performance CPUs and GPUs. #### 3. Ultra-Low DCR The DC Resistance is extremely low (0.17 mΩ). This minimizes **$I^2R$** losses (heat generated by resistance), allowing the part to handle high continuous currents while remaining relatively cool. --- ### Applications * **Multi-phase VCORE regulators:** Used to supply power to modern processors. * **Voltage Regulator Modules (VRM):** Common in high-end motherboards and server blades. * **Point-of-Load (POL) Converters:** Used in telecommunications and data storage systems. --- ### PCB Layout Considerations To ensure the best performance from this part: ```c // Design Best Practices: 1. Use wide copper traces to handle 50A+ currents. 2. Place multiple thermal vias under the pads to dissipate heat. 3. Keep the inductor close to the MOSFETs to minimize parasitic inductance. ```
    ✨ Follow-up Questions
    • What are the alternatives to the FP1008 series for higher inductance requirements?
    • How does the 'R' suffix impact the RoHS compliance of this part?
    • How do you calculate the temperature rise for this inductor at 50A?