The **FP1107R2-R40-R** is a high-current, high-frequency power inductor typically used in multi-phase voltage regulator modules (VRMs). It is manufactured by Eaton (formerly Cooper Bussmann/Coiltronics). ### 1. Technical Specifications The following table summarizes the key electrical and physical characteristics of the component: | Parameter | Value | | :--- | :--- | | **Inductance (L)** | 400 nH (0.40 µH) | | **Tolerance** | ±10% | | **Full Part Number Breakdown** | FP (Flat-Pac), 1107 (Size), R2 (Version), R40 (Inductance), R (RoHS) | | **Saturation Current ($I_{sat}$)** | ~61 Amps (at 25°C) | | **RMS Current ($I_{rms}$)** | ~51 Amps | | **DC Resistance (DCR)** | 0.29 mΩ (Typical) | | **Operating Temperature** | -40°C to +125°C | | **Footprint/Size** | 11.0mm x 7.2mm x 7.5mm | --- ### 2. Core Features * **High Current Handling:** Designed specifically for low-voltage, high-current applications where power density is critical. * **Controlled DCR:** The very low Direct Current Resistance (0.29 mΩ) minimizes power loss and heat generation. * **Ferrite Core Material:** Utilizes a ferrite core which provides low core losses at high frequencies (up to 2 MHz). * **Flat-Pac™ Construction:** The "FP" designation indicates a vertical, surface-mount design that saves PCB real estate while maintaining a high current profile. --- ### 3. Common Applications This part is standard in high-performance computing environments: 1. **Voltage Regulator Modules (VRMs):** Used in servers and workstations to step down voltage for CPUs and GPUs. 2. **Point-of-Load (POL) Converters:** Providing stable power to FPGAs and ASICs. 3. **Data Centers:** High-density power supplies and networking equipment. --- ### 4. Footprint and Mounting The inductor uses a two-terminal surface mount design. Below is a conceptual representation of the landing pattern: ```text [ 11.0 mm ] ___________________ | | | Top View | [ 7.2 mm ] |___________________| [Pad] [Pad] ``` ---