The **FP1109-R47-R** is a high-current, shielded power inductor designed primarily for use in voltage regulator modules (VRMs) and DC-to-DC converters. It is manufactured by **Eaton (formerly Cooper Bussmann)** as part of the FP1109 series. --- ### 1. Key Technical Specifications The model number "R47" specifically identifies the inductance value. Below are the primary technical parameters: | Parameter | Specification | | :--- | :--- | | **Inductance** | 0.47 µH | | **Tolerance** | ±10% | | **DC Resistance (DCR)** | 0.42 mΩ (Typical) | | **Saturation Current ($I_{sat}$)** | 45 A | | **RMS Current ($I_{rms}$)** | 35 A | | **Operating Temperature** | -40°C to +125°C | | **Package / Case** | SMD (Surface Mount Device) | | **Dimensions** | 11.0mm x 8.0mm x 9.0mm | --- ### 2. Core Features * **High Current Handling:** Designed to manage high peak currents (up to 45A) without core saturation, making it ideal for modern high-performance processors. * **Low DCR:** The ultra-low direct current resistance (0.42 mΩ) minimizes power loss due to heat, significantly increasing overall power supply efficiency. * **Magnetic Shielding:** The part is ferrite-shielded to reduce Electromagnetic Interference (EMI), which is critical in dense PCB layouts. * **Flat-Wire Construction:** Uses a flat-wire winding technique to maximize the cross-sectional area of the conductor, reducing skin effect losses at high frequencies. --- ### 3. Applications The FP1109-R47-R is commonly found in environments requiring stable power delivery under heavy loads: 1. **Multi-phase Buck Regulators:** Used in CPU/GPU power stages for servers and high-end desktops. 2. **Voltage Regulator Modules (VRM):** Critical for stepping down voltages for low-voltage, high-current components. 3. **Data Center Infrastructure:** Powering networking switches and storage systems. 4. **Point of Load (POL) Converters:** Providing localized power regulation on complex circuit boards. --- ### 4. Footprint and Soldering The component is designed for **SMT (Surface Mount Technology)**. It features a vertical orientation (the "1109" refers to its 11.0mm x 9.0mm footprint/height profile), which saves horizontal board space but requires vertical clearance. ```text // Example PCB Pad Layout (Approximate) [ Pad 1 ] ---- 3.5mm ---- [ Pad 2 ] | | | Inductor Body | | 11.0mm x 8.0mm | ``` ---