The **FP1505R1-R15-R** is a high-current, flat-pac power inductor typically used in voltage regulator modules (VRMs) and high-density power converters. It is manufactured by Eaton (formerly Cooper Bussmann/Coiltronics). ### 1. General Specifications This component is part of the FP1505 series, designed for low-voltage, high-current applications where efficiency and space are critical. | Parameter | Specification | | :--- | :--- | | **Inductance** | 0.150 µH (150 nH) | | **Tolerance** | ±10% | | **Full Part Number** | FP1505R1-R15-R | | **DC Resistance (DCR)** | ~0.19 mΩ (Nominal) | | **Saturation Current ($I_{sat}$)** | ~83 Amps | | **RMS Current ($I_{rms}$)** | ~72 Amps | | **Operating Temp** | -40°C to +125°C | --- ### 2. Key Features * **High Current Density:** Capable of handling very high peak currents without saturating, making it ideal for CPU/GPU power stages. * **Low DCR:** The extremely low DC resistance (measured in micro-ohms) minimizes power loss due to heat (I²R losses). * **Magnetic Shielding:** The ferrite core construction provides self-shielding, which reduces electromagnetic interference (EMI) with surrounding components. * **Surface Mount Design:** Optimized for automated SMT (Surface Mount Technology) assembly. --- ### 3. Applications The FP1505 series is commonly found in: 1. **Multi-phase Buck Converters:** Used in servers and workstations to power processors. 2. **Voltage Regulator Modules (VRM):** Specifically for high-speed data centers. 3. **Graphics Cards:** High-end GPUs require several of these inductors to manage power delivery. 4. **Point-of-Load (POL) Converters:** For telecommunications and networking equipment. --- ### 4. Part Number Breakdown The naming convention follows a specific logic: | Code | Meaning | | :--- | :--- | | **FP1505** | Product Series & Physical Size (approx. 15mm x 5mm) | | **R1** | Revision or variation code | | **R15** | Inductance value (R15 = 0.15 µH) | | **-R** | RoHS Compliant | --- ### 5. Footprint and Mounting The inductor uses a two-terminal SMT pad layout. Due to the high current levels, it is recommended to use wide copper traces and multiple thermal vias to assist with heat dissipation.