The **FP1505R1-R25-R** is a high-current, non-isolated power inductor manufactured by **Eaton (formerly Cooper Bussmann)**. It belongs to the **FP1505 series**, which is specifically designed for high-frequency voltage regulator modules (VRMs) and point-of-load (POL) converters. --- ### 1. Technical Specifications The following table summarizes the primary electrical and physical characteristics: | Parameter | Value | | :--- | :--- | | **Inductance** | 0.25 µH (250 nH) | | **Tolerance** | ±10% | | **Current Rating (Irms)** | 63 A | | **Saturation Current (Isat)** | 80 A (at 25°C) | | **DC Resistance (DCR)** | 0.23 mΩ (Typical) | | **Operating Temperature** | -40°C to +125°C | | **Package / Case** | 15.0mm x 5.0mm x 5.0mm (SMD) | | **Mounting Type** | Surface Mount (SMT) | --- ### 2. Key Features * **High Current Density:** Capable of handling massive amounts of current (up to 80A peak) relative to its small physical footprint. * **Low DCR:** The exceptionally low Direct Current Resistance (0.23 mΩ) minimizes power loss and heat generation, increasing overall system efficiency. * **Ferrite Core Material:** Uses high-frequency ferrite material that provides low core losses, making it ideal for multi-phase buck converters. * **Flat-Wire Construction:** The "FP" (Flat Pac) design uses flat copper wire to maximize the winding area and reduce skin effect losses at high frequencies. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **FP:** Product Series (Flat Pac). * **1505:** Physical dimensions (approx. 15mm length, 5mm width). * **R1:** Revision/Version code (Standard version). * **R25:** Inductance value (R25 = 0.25 µH). * **-R:** RoHS compliant. --- ### 4. Common Applications This inductor is typically found in high-performance computing environments where stable, high-current power delivery is critical: 1. **Server CPU/GPU VRMs:** Providing stable power to high-end processors. 2. **Graphics Cards:** High-wattage power stages for GPUs. 3. **Networking Equipment:** High-speed routers and switches. 4. **Data Centers:** Power modules for high-density storage and compute nodes. ---