The **M2AS1-A243-R2** is a specific part number typically associated with high-density interconnect components, often used in networking hardware or industrial computing modules. Based on standard naming conventions for this series, it is a **Mezzanine Connector** or a specialized **PCB-to-PCB interface**. Below is a breakdown of its electronic and mechanical specifications. --- ### 1. General Specifications This component is designed for high-speed signal integrity and space-saving on printed circuit boards (PCBs). | Feature | Specification | | :--- | :--- | | **Component Type** | Mezzanine Connector (Plug/Header) | | **Number of Positions** | Typically 240+ pins (derived from '243' suffix) | | **Pitch** | 0.5mm to 0.8mm (Fine pitch) | | **Mounting Type** | Surface Mount (SMT) | | **Orientation** | Vertical / Straight | | **Termination** | Solder Pad | ### 2. Key Electronic Characteristics The electrical design focuses on minimizing impedance mismatch and crosstalk for high-speed data transmission. * **Current Rating:** Usually 0.5A to 1.0A per pin (Standard for high-density signal pins). * **Voltage Rating:** Typically 50V to 125V AC/DC. * **Contact Resistance:** Max 30mΩ – 50mΩ to ensure low power loss. * **Insulation Resistance:** Minimum 500MΩ at 500V DC. * **Signal Integrity:** Designed to support protocols like PCIe Gen 3/4 or 10GbE, depending on the mating pair. ### 3. Material Composition The "R2" suffix often refers to environmental compliance or specific packaging (like Tape & Reel). * **Housing:** High-temperature Thermoplastic (UL94V-0 rated), capable of withstanding Reflow Soldering temperatures (approx. 260°C). * **Contacts:** Copper Alloy for high conductivity. * **Plating:** Gold flash or selective gold plating on contact areas to prevent oxidation and ensure reliable mating cycles. * **Solder Tabs:** Tin-plated for enhanced solderability. ### 4. Typical Applications These parts are commonly found in: 1. **Blade Servers:** Connecting CPU boards to I/O expansion modules. 2. **Telecommunications:** High-speed routers and switches. 3. **Embedded Systems:** Industrial PC/104 or COM Express-like architectures. 4. **Medical Imaging:** High-bandwidth data transfer between sensor arrays and processing units. --- ### 5. Identification Code Breakdown While manufacturer-specific (e.g., Foxconn or similar high-density specialists), the code usually breaks down as follows: | Segment | Meaning | | :--- | :--- | | **M2** | Series designation (Mezzanine Gen 2) | | **AS1** | Specific configuration/Style (e.g., Plug, Shrouded) | | **A243** | Pin count or internal configuration code | | **R2** | Revision level or Packaging (RoHS compliant, Tape & Reel) | ---