M2AVS-D136-R2
AI

The **M2AVS-D136-R2** is a specialized high-speed connector component, typically part of the **M.2 (NGFF) connector series** produced by manufacturers like Lotes or JAE. It is designed to facilitate the connection between a motherboard (host) and an M.2 expansion card (such as an NVMe SSD or a Wi-Fi module).
---
### 1. Key Technical Specifications
Based on the standard nomenclature for this specific part number (R2 revision), here are the primary electronic and physical characteristics:
| Feature | Specification |
| :--- | :--- |
| **Connector Type** | M.2 (Next Generation Form Factor - NGFF) |
| **Mounting Type** | Surface Mount (SMT), Right Angle |
| **Pin Count** | 67-Pin (Standard for M.2) |
| **Keying** | Typically **M-Key** (Common for PCIe x4 NVMe SSDs) |
| **Pitch** | 0.50 mm |
| **Height** | Usually 3.2mm or 4.2mm (Model dependent) |
| **Contact Plating** | Gold (Flash or 15u" depending on specific sub-code) |
---
### 2. Electronic Functions & Pinout
The M2AVS series acts as a high-density bridge for several signal protocols. Because it is an M-Keyed connector, it supports the following electronic interfaces:
1. **PCI Express (PCIe):** Supports up to 4 lanes (x4) for high-speed data transfer (Gen 3 or Gen 4).
2. **SATA 3.0:** Provides legacy support for SATA-based M.2 drives.
3. **Power Delivery:** Pins are dedicated to providing **3.3V DC** to the module.
4. **Sideband Signals:** Includes clock signals (REFCLK), reset signals (PERST#), and sleep signals (CLKREQ#).
---
### 3. Physical Construction
The "R2" suffix usually denotes a specific revision or packaging style (like Tape & Reel for automated assembly).
* **Housing Material:** High-temperature thermoplastic (LCP - Liquid Crystal Polymer) to withstand reflow soldering temperatures.
* **Contacts:** Copper alloy for high conductivity and durability.
* **Solder Tabs:** Includes metal ear-tabs for mechanical stability to prevent the connector from lifting off the PCB during SSD installation.
---
### 4. Typical Application Circuit
When integrating this part into a PCB design, the electronic layout usually follows this logic:
```c
// Simplified Layout Logic
[ Motherboard Chipset ] <---> [ Differential Pairs (TX/RX) ] <---> [ M2AVS-D136-R2 ]
|
[ 3.3V Rail ] <--- Decoupling Caps (10uF + 0.1uF)
```
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- ⤷
What is the difference between M-key and B-key for this connector?
- ⤷ What are the recommended soldering temperature profiles for the M2AVS series?
- ⤷ How does the 'R2' revision differ from the original version?