Based on the product code structure, the **M2PHS2H-A4-R** is a specific configuration of a high-density, high-speed connector, typically part of a modular backplane or mezzanine system (often associated with brands like Foxconn or similar industrial connector manufacturers). Below is the technical breakdown of the electronic components and specifications for this part. --- ### 1. Technical Specifications | Parameter | Specification Details | | :--- | :--- | | **Component Type** | High-Speed Mezzanine/Backplane Connector | | **Gender** | Header (Male Pins) | | **Pitch** | Typically 0.5mm or 0.8mm (Density dependent) | | **Number of Rows** | 2-4 Rows (Configuration specific) | | **Mounting Type** | Surface Mount (SMT) or Through-Hole Reflow | | **Plating** | Gold (Au) Flash or Selective Gold on Contact Area | | **Termination** | Vertical Orientation | --- ### 2. Key Electronic Features #### A. Signal Integrity (SI) These connectors are designed for high-speed differential signaling. The "HS" in the part number often denotes **High Speed**, optimized to minimize: * **Crosstalk:** Reducing interference between adjacent signal pins. * **Insertion Loss:** Ensuring signal strength is maintained across the interface. * **Impedance Matching:** Usually tuned to 85Ω or 100Ω for PCIe or Ethernet standards. #### B. Contact Design * **Two-Point Contact:** The "2H" often refers to a dual-contact point system, which ensures a reliable electrical connection even under vibration or thermal expansion. * **Wiping Action:** The pins are designed to "wipe" away surface oxidation during mating to maintain low contact resistance. #### C. Materials * **Housing:** High-temperature LCP (Liquid Crystal Polymer) plastic, capable of withstanding lead-free reflow soldering temperatures (up to 260°C). * **Contacts:** Copper alloy for high conductivity and spring resilience. --- ### 3. Application Use Cases These parts are integrated into complex electronic assemblies such as: 1. **Server Blades:** Connecting processor cards to the main backplane. 2. **Networking Switches:** High-bandwidth data transfer between line cards. 3. **Industrial Computing:** Modular PC/104 or COM Express-style architectures. 4. **FPGA Development Boards:** Connecting high-speed daughterboards (mezzanine cards). --- ### 4. Part Number Breakdown (Generic Interpretation) | Code Segment | Likely Meaning | | :--- | :--- | | **M2** | Series identifier (Metric/Modular) | | **PH** | Pin Header / Plug | | **S** | Straight orientation | | **2H** | 2-High or Dual-Contact height | | **A4** | Pin count or specific keying code | | **-R** | Tape & Reel packaging (for automated SMT pick-and-place) | ---