The **M2PHS2H-C4-R2/Q** is a high-precision, industrial-grade connector assembly typically used in board-to-board or high-speed data transmission applications. This specific part number follows the nomenclature standards of manufacturers like **Samtec** or similar high-performance interconnect companies. Below is a breakdown of the electronic components and technical specifications associated with this part: ### 1. Technical Specifications | Feature | Description | | :--- | :--- | | **Connector Type** | High-speed Mezzanine Header | | **Pitch** | Typically 0.50mm or 0.80mm (depending on series) | | **Pin Configuration** | 2 Rows (Dual Row) | | **Contact Material** | Phosphor Bronze or Beryllium Copper | | **Plating** | Gold (Flash or 10µ") over Nickel on contact area | | **Mounting Type** | Surface Mount (SMT) | | **Termination** | Vertical Orientation | --- ### 2. Part Number Breakdown (Nomenclature) While prefixes vary by brand, the string generally represents the following physical characteristics: * **M2P:** Series designation (often indicating High-Speed/Micro Pitch). * **HS2:** High-Speed, 2-row configuration. * **H:** Header (Male side of the connection). * **C4:** Circuit count or Stack Height code (Determines the distance between PCBs). * **R2:** Reel packaging (Tape & Reel) for automated assembly. * **Q:** Quality/Qualification grade (often signifies Automotive or High-Reliability testing). --- ### 3. Key Electronic Characteristics #### Signal Integrity These connectors are designed to minimize **Crosstalk** and **Insertion Loss**. They often feature an internal ground plane or specific pin-out patterns to maintain differential impedance (usually 100 $\Omega$). #### Current Rating * **Per Pin:** Typically 0.5A to 1.0A. * **Voltage:** Rated for ~125V AC or DC. #### Durability * **Mating Cycles:** Usually rated for 100 to 500 cycles. * **Operating Temperature:** -55°C to +125°C. --- ### 4. Applications This part is commonly integrated into: 1. **Telecommunications:** Network switches and routers. 2. **Industrial Computing:** Embedded modules (COM Express). 3. **Medical Imaging:** High-bandwidth data transfer between sensor boards and processing units. 4. **Automotive:** ADAS (Advanced Driver Assistance Systems) modules. ---