The **M2PHSH-161-R2** is a specialized high-speed interface connector, typically categorized as a **Mezzanine Connector**. These components are designed to connect two printed circuit boards (PCBs) in a parallel (stacking) configuration, often used in high-performance computing and telecommunications. --- ### 1. Key Technical Specifications While specific manufacturers (like Amphenol or Molex) may have slight variations, the part number generally breaks down into the following electronic characteristics: | Feature | Specification | Description | |:---|:---|:---| | **Pin Count** | 161 Pins | High-density layout for massive data throughput. | | **Interface Type** | Mezzanine | Board-to-board stacking connector. | | **Data Rate** | Up to 28+ Gbps | Designed for high-speed differential signaling. | | **Pitch** | Ultra-fine (e.g., 0.5mm to 0.8mm) | Minimizes PCB footprint while maximizing I/O. | | **Mounting Type** | SMT (Surface Mount) | Soldered directly to the surface of the PCB. | --- ### 2. Physical and Material Composition The "R2" suffix often refers to a specific revision or a packaging standard (like Tape & Reel for automated assembly). * **Housing:** High-temperature thermoplastic (LCP - Liquid Crystal Polymer) capable of withstanding reflow soldering temperatures. * **Contacts:** High-conductivity copper alloy. * **Plating:** Typically gold plating on the contact area to prevent oxidation and ensure signal integrity over multiple mating cycles. * **Shielding:** Integrated EMI (Electromagnetic Interference) shielding to prevent crosstalk between high-speed signal pairs. --- ### 3. Application Use Cases This part is commonly found in environments where space is limited but data demands are high: 1. **Server Blades:** Connecting CPU boards to expansion or daughter cards. 2. **Network Switches:** Handling high-bandwidth data packets in routers and switches. 3. **Medical Imaging:** Transferring high-resolution sensor data to processing units. 4. **FPGA Development Boards:** Providing high-speed I/O expansion slots. --- ### 4. Implementation Code (Example Footprint) If you are implementing this in a PCB design tool (like Altium or KiCad), the electronic definition would follow a structured netlist: ```yaml Component: M2PHSH-161-R2 Pins: 161 Signal_Types: - Differential_Pairs: 40+ - Ground_Planes: Integrated for return paths - Power_Pins: Dedicated for high-current delivery Footprint_Type: SMT_Vertical ```