The part number **M2PHSH-BB-R2SLASHN** refers to a high-speed, high-density mezzanine connector, typically manufactured by companies like **Molex** or specialized interconnect suppliers (often associated with the Mirror Mezz family). Below is a breakdown of the electronic and mechanical specifications for this type of component. --- ### 1. Component Identification This part is a **Mezzanine Connector**, designed to connect two parallel printed circuit boards (PCBs) in a stacking configuration. | Feature | Specification | | :--- | :--- | | **Connector Type** | Hermaphroditic (Mates to itself) | | **Data Rates** | Up to 56 Gbps (PAM-4) or 112 Gbps | | **Mounting Type** | Surface Mount (SMT) / BGA | | **Application** | Data Centers, Servers, Networking, Telecommunications | --- ### 2. Key Electronic Characteristics * **Hermaphroditic Design:** Unlike standard male/female pairs, this connector mates with an identical part. This simplifies the Bill of Materials (BOM) because only one part number is needed for both sides of the interface. * **High Signal Integrity:** These connectors are engineered to minimize crosstalk and return loss, making them suitable for PCIe Gen 5/6 and Ethernet protocols. * **Stitched Contact System:** Provides multiple points of contact for increased reliability and lower resistance. * **Impedance Control:** Usually tuned to **92 Ohms** or **100 Ohms** to match differential pair signaling requirements. --- ### 3. Mechanical & Material Specs | Attribute | Details | | :--- | :--- | | **Contact Plating** | Gold (Au) over Nickel (Ni) for corrosion resistance. | | **Housing Material** | High-temperature Liquid Crystal Polymer (LCP). | | **Stack Height** | Variable based on the specific "R2" revision (often 2.5mm to 5mm). | | **Pitch** | Typically 0.50mm or 1.00mm. | --- ### 4. Part Number Breakdown (General Logic) While naming conventions vary by manufacturer, the string generally follows this logic: 1. **M2:** Mirror Mezz series or similar high-speed family. 2. **PH/SH:** Often refers to Pin Header / Socket Header (or hermaphroditic configuration). 3. **BB:** Board-to-Board orientation. 4. **R2:** Revision 2 or 2-row configuration. 5. **SLASHN:** Refers to specific packaging (e.g., Tape and Reel) or a lead-free (RoHS) designation. --- ### 5. Common Use Cases * **GPU to Baseboard:** Connecting AI accelerator modules to a main carrier board. * **Storage Arrays:** High-speed NVMe drive arrays. * **Network Switches:** Connecting daughter cards to the main switching fabric. ---