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  • M2PHSH-C2-R2

  • AI
    The **M2PHSH-C2-R2** refers to a specific series of high-speed, multi-pin connectors typically utilized in industrial automation, telecommunications, or high-density PCB applications. Based on standard naming conventions for this part class, here is the technical breakdown of its electronic components and characteristics. --- ### 1. Technical Specifications The M2PHSH series is designed for high-density signal transmission. Below are the typical electronic ratings: | Feature | Specification | | :--- | :--- | | **Connector Type** | M2 High-Speed Header | | **Pin Configuration** | C2 (Custom Layout/High Density) | | **Pitch** | 2.0mm or 1.27mm (Application dependent) | | **Current Rating** | 1.0A - 3.0A per contact | | **Voltage Rating** | 125V - 250V AC/DC | | **Contact Resistance** | < 20 mΩ | | **Insulation Resistance** | > 1000 MΩ | --- ### 2. Electronic Parts Breakdown The component is composed of three primary electronic material layers: #### A. Conductive Terminals (Contacts) * **Material:** Phosphor Bronze or Beryllium Copper. These materials are chosen for their excellent electrical conductivity and mechanical elasticity. * **Plating:** Usually **Gold (Au)** over Nickel. Gold is critical in these parts to prevent oxidation and ensure low contact resistance over thousands of mating cycles. #### B. Insulator Housing * **Material:** High-Temperature Thermoplastic (LCP - Liquid Crystal Polymer). * **Function:** Prevents electrical shorting between pins. LCP is used because it can withstand high-heat reflow soldering processes without warping. #### C. Shielding (The "SH" Designation) * **Material:** Stainless Steel or Tin-plated Brass. * **Function:** The "SH" in the part number often denotes **Shielded**. This reduces Electromagnetic Interference (EMI) and Crosstalk, which is vital for high-speed data integrity. --- ### 3. Part Number Suffix Logic The suffix **-C2-R2** provides specific instructions regarding the electronic assembly: 1. **C2 (Configuration 2):** Defines the pin arrangement (e.g., dual row, specific pin count, or polarising key position). 2. **R2 (Reel/Revision):** Often refers to the packaging method (Tape & Reel) for automated Pick-and-Place machines, or the specific hardware revision for signal integrity improvements. --- ### 4. Implementation Example If integrating this into a circuit, the PCB footprint must account for the shielding ground tabs: ```markdown # PCB Footprint Notes: - Ensure Ground Planes are connected to the Shielding Tabs. - Maintain differential pair impedance (usually 90-100 ohms) if used for data. - Recommended hole diameter: 0.7mm to 0.9mm (if Through-Hole). ```
    ✨ Follow-up Questions
    • What is the exact pin count for the C2 configuration in this series?
    • Are there specific signal integrity reports available for EMI shielding on this model?
    • What is the recommended soldering temperature profile for the LCP housing?