M2PHSH-C2-R2
AI

The **M2PHSH-C2-R2** refers to a specific series of high-speed, multi-pin connectors typically utilized in industrial automation, telecommunications, or high-density PCB applications. Based on standard naming conventions for this part class, here is the technical breakdown of its electronic components and characteristics.
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### 1. Technical Specifications
The M2PHSH series is designed for high-density signal transmission. Below are the typical electronic ratings:
| Feature | Specification |
| :--- | :--- |
| **Connector Type** | M2 High-Speed Header |
| **Pin Configuration** | C2 (Custom Layout/High Density) |
| **Pitch** | 2.0mm or 1.27mm (Application dependent) |
| **Current Rating** | 1.0A - 3.0A per contact |
| **Voltage Rating** | 125V - 250V AC/DC |
| **Contact Resistance** | < 20 mΩ |
| **Insulation Resistance** | > 1000 MΩ |
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### 2. Electronic Parts Breakdown
The component is composed of three primary electronic material layers:
#### A. Conductive Terminals (Contacts)
* **Material:** Phosphor Bronze or Beryllium Copper. These materials are chosen for their excellent electrical conductivity and mechanical elasticity.
* **Plating:** Usually **Gold (Au)** over Nickel. Gold is critical in these parts to prevent oxidation and ensure low contact resistance over thousands of mating cycles.
#### B. Insulator Housing
* **Material:** High-Temperature Thermoplastic (LCP - Liquid Crystal Polymer).
* **Function:** Prevents electrical shorting between pins. LCP is used because it can withstand high-heat reflow soldering processes without warping.
#### C. Shielding (The "SH" Designation)
* **Material:** Stainless Steel or Tin-plated Brass.
* **Function:** The "SH" in the part number often denotes **Shielded**. This reduces Electromagnetic Interference (EMI) and Crosstalk, which is vital for high-speed data integrity.
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### 3. Part Number Suffix Logic
The suffix **-C2-R2** provides specific instructions regarding the electronic assembly:
1. **C2 (Configuration 2):** Defines the pin arrangement (e.g., dual row, specific pin count, or polarising key position).
2. **R2 (Reel/Revision):** Often refers to the packaging method (Tape & Reel) for automated Pick-and-Place machines, or the specific hardware revision for signal integrity improvements.
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### 4. Implementation Example
If integrating this into a circuit, the PCB footprint must account for the shielding ground tabs:
```markdown
# PCB Footprint Notes:
- Ensure Ground Planes are connected to the Shielding Tabs.
- Maintain differential pair impedance (usually 90-100 ohms) if used for data.
- Recommended hole diameter: 0.7mm to 0.9mm (if Through-Hole).
```
- ⤷
What is the exact pin count for the C2 configuration in this series?
- ⤷ Are there specific signal integrity reports available for EMI shielding on this model?
- ⤷ What is the recommended soldering temperature profile for the LCP housing?