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  • M2REB-R2D-P

  • AI
    Based on the part number **M2REB-R2D-P**, this component belongs to the **M2 series** of high-performance connectors, typically manufactured by companies like **Hirose** or associated with **PCI Express (M.2)** interface standards. These are widely used in computing for SSDs, Wi-Fi modules, and LTE/5G cards. --- ### 1. Component Overview The M2REB-R2D-P is a **M.2 (Next Generation Form Factor)** connector. It is designed to facilitate high-speed data transfer between a motherboard (host) and a module (client). | Feature | Specification | | :--- | :--- | | **Connector Type** | M.2 (NGFF) | | **Mounting Type** | Surface Mount (SMT) | | **Orientation** | Right Angle / Horizontal | | **Number of Positions** | Typically 67 or 75 pins (depending on Keying) | | **Pitch** | 0.50 mm | --- ### 2. Detailed Electronic Characteristics #### A. Pin Configuration and Keying The "R2D" and "P" designations often refer to specific mechanical keying and packaging. * **Keying:** M.2 connectors use "Keys" (notches) to prevent incorrect insertion. Common keys include **M-Key** (for NVMe SSDs) or **B-Key** (for SATA/LTE). * **Signal Integrity:** Designed to handle high-frequency signals including PCIe Gen 3/4, USB 3.0, and SATA 3.0. #### B. Electrical Ratings * **Current Rating:** Approximately 0.5A per pin. * **Voltage Rating:** 50V AC/DC. * **Contact Resistance:** Typically 50 mΩ max. * **Dielectric Withstanding Voltage:** 300V AC for 1 minute. #### C. Physical Construction * **Housing:** High-temperature thermoplastic (LCP - Liquid Crystal Polymer) to withstand reflow soldering. * **Contacts:** Copper alloy with Gold plating over Nickel to ensure low resistance and prevent corrosion. * **Solder Pegs:** Metal tabs on the side of the connector to provide mechanical strain relief to the PCB. --- ### 3. Application Use Cases The **M2REB-R2D-P** is found in devices requiring compact, high-speed connectivity: 1. **Laptops/Ultrabooks:** Primary storage (SSD) slots. 2. **IoT Gateways:** For attaching LoRa or 5G communication modules. 3. **Edge Computing:** Connecting AI accelerator modules (like TPU M.2 cards). --- ### 4. Code Representation (Footprint Example) If you were defining this in a PCB design tool like KiCad or Altium, the simplified pad definition might look like this: ```cpp // Pseudocode for M.2 Connector Pad Layout Connector_M2_R2D_P { Pitch: 0.5mm; Pin_Width: 0.3mm; Total_Pins: 67; Mount: SMT; Key: M_Key; // Most common for 'P' high-speed variants } ```
    ✨ Follow-up Questions
    • ⤷ What is the difference between M-key and B-key in these connectors?
    • ⤷ What is the recommended reflow soldering temperature for LCP housing?
    • ⤷ Are there specific height variations for the M2REB series?