M2REB-R2D-P
AI

Based on the part number **M2REB-R2D-P**, this component belongs to the **M2 series** of high-performance connectors, typically manufactured by companies like **Hirose** or associated with **PCI Express (M.2)** interface standards. These are widely used in computing for SSDs, Wi-Fi modules, and LTE/5G cards.
---
### 1. Component Overview
The M2REB-R2D-P is a **M.2 (Next Generation Form Factor)** connector. It is designed to facilitate high-speed data transfer between a motherboard (host) and a module (client).
| Feature | Specification |
| :--- | :--- |
| **Connector Type** | M.2 (NGFF) |
| **Mounting Type** | Surface Mount (SMT) |
| **Orientation** | Right Angle / Horizontal |
| **Number of Positions** | Typically 67 or 75 pins (depending on Keying) |
| **Pitch** | 0.50 mm |
---
### 2. Detailed Electronic Characteristics
#### A. Pin Configuration and Keying
The "R2D" and "P" designations often refer to specific mechanical keying and packaging.
* **Keying:** M.2 connectors use "Keys" (notches) to prevent incorrect insertion. Common keys include **M-Key** (for NVMe SSDs) or **B-Key** (for SATA/LTE).
* **Signal Integrity:** Designed to handle high-frequency signals including PCIe Gen 3/4, USB 3.0, and SATA 3.0.
#### B. Electrical Ratings
* **Current Rating:** Approximately 0.5A per pin.
* **Voltage Rating:** 50V AC/DC.
* **Contact Resistance:** Typically 50 mΩ max.
* **Dielectric Withstanding Voltage:** 300V AC for 1 minute.
#### C. Physical Construction
* **Housing:** High-temperature thermoplastic (LCP - Liquid Crystal Polymer) to withstand reflow soldering.
* **Contacts:** Copper alloy with Gold plating over Nickel to ensure low resistance and prevent corrosion.
* **Solder Pegs:** Metal tabs on the side of the connector to provide mechanical strain relief to the PCB.
---
### 3. Application Use Cases
The **M2REB-R2D-P** is found in devices requiring compact, high-speed connectivity:
1. **Laptops/Ultrabooks:** Primary storage (SSD) slots.
2. **IoT Gateways:** For attaching LoRa or 5G communication modules.
3. **Edge Computing:** Connecting AI accelerator modules (like TPU M.2 cards).
---
### 4. Code Representation (Footprint Example)
If you were defining this in a PCB design tool like KiCad or Altium, the simplified pad definition might look like this:
```cpp
// Pseudocode for M.2 Connector Pad Layout
Connector_M2_R2D_P {
Pitch: 0.5mm;
Pin_Width: 0.3mm;
Total_Pins: 67;
Mount: SMT;
Key: M_Key; // Most common for 'P' high-speed variants
}
```
- ⤷
What is the difference between M-key and B-key in these connectors?
- ⤷ What is the recommended reflow soldering temperature for LCP housing?
- ⤷ Are there specific height variations for the M2REB series?