The **M2REB-R2D-R** belongs to a specific series of industrial-grade connectors, typically associated with high-density interconnect solutions used in telecommunications, networking, and industrial automation. Below is a detailed breakdown of its electronic characteristics and specifications. --- ## 1. Product Identification and Type The part number follows a modular nomenclature common in high-speed or high-density board-to-board connectors. | Feature | Specification | | :--- | :--- | | **Component Type** | Board-to-Board / High-Density Connector | | **Series** | M2 Series | | **Mounting Type** | Through-hole or SMT (depending on specific R2D sub-variant) | | **Contact Orientation** | Right Angle (RA) | | **Gender** | Receptacle (Female) | --- ## 2. Key Electronic Specifications These parts are designed for reliability in environments where signal integrity is critical. ### Electrical Characteristics * **Current Rating:** Typically ranges from **0.5A to 1.0A** per contact (varies by pitch). * **Voltage Rating:** Usually **125V AC/DC**. * **Contact Resistance:** Low initial resistance (approx. **20-30 mΩ max**) to prevent voltage drops. * **Insulation Resistance:** Minimum **500MΩ** to ensure isolation between high-density pins. * **Dielectric Withstanding Voltage:** Capable of handling **500V AC** for one minute without breakdown. --- ## 3. Material and Physical Construction The materials are chosen for thermal stability during soldering and long-term durability. ### Material Table | Component | Material | Notes | | :--- | :--- | :--- | | **Insulator** | LCP or PBT Plastic | High-temperature resistance for reflow soldering. | | **Contact Material** | Phosphor Bronze or Copper Alloy | Provides excellent conductivity and spring force. | | **Plating** | Gold (Au) over Nickel (Ni) | Gold is used on the contact area to prevent oxidation. | | **Shielding** | Metal Shell (optional) | Provides EMI/RFI protection for high-speed signals. | --- ## 4. Common Applications Due to the "R2D" (Right Angle, Double Row) configuration, this part is commonly found in: * **Backplane Interconnects:** Connecting a daughter card to a mother board at a 90-degree angle. * **Blade Servers:** Used in high-density computing environments. * **Industrial Controllers:** PLC modules where space-saving vertical integration is required. * **Telecommunications:** Routing high-speed data across PCB interfaces. ---