The **M2SES-261-R2** is a specialized electronic component, typically classified as a high-reliability **Micro-D connector** or a high-density interconnect solution. These parts are frequently used in aerospace, defense, and high-end industrial applications where space is limited and vibration resistance is critical. --- ### 1. Technical Specifications The "M2SES" series generally follows specifications derived from or compatible with MIL-DTL-83513 standards. Below are the typical electronic and physical attributes: | Feature | Specification | | :--- | :--- | | **Contact Density** | High-density Micro-D | | **Pitch** | 0.050" (1.27 mm) centers | | **Contact Type** | Pin (Plug) or Socket (Receptacle) | | **Shell Material** | Aluminum Alloy (often Nickel or Gold plated) | | **Insulator** | Liquid Crystal Polymer (LCP) or Polyphenylene Sulfide (PPS) | | **Mounting Style** | PCB Mount (Right Angle or Vertical) or Wire Crimp | --- ### 2. Key Electronic Properties * **Current Rating:** Usually rated for **3 Amps** per contact. * **Dielectric Withstanding Voltage:** Typically **600 VAC** at sea level. * **Insulation Resistance:** Minimum of **5,000 Megohms** at 500 VDC. * **Contact Resistance:** Maximum of **8 milliohms** (depending on wire size). * **Operating Temperature:** Generally rated from **-55°C to +125°C**. --- ### 3. Structural Components The part number breakdown usually indicates specific configurations: 1. **The Shell:** Provides EMI/RFI shielding and physical protection for the pins. 2. **Twist Pin Contacts:** Unlike standard stamped pins, these use a "twist pin" design which creates multiple points of contact, ensuring electrical continuity even under extreme vibration. 3. **Interfacial Seal:** A silicone rubber seal that prevents moisture or contaminants from entering the connection point. --- ### 4. Common Applications Due to its robust electronic profile, this part is found in: * **Avionics:** Flight control systems and cockpit displays. * **Satellites:** Data handling units where weight and space are at a premium. * **Medical Imaging:** High-density signal routing in portable devices. * **Downhole Drilling:** High-temperature and high-vibration environments.