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  • M2XU-R1Z1-R/Q

  • AI
    Based on the part number structure, the **M2XU-R1Z1-R/Q** refers to a high-performance **M.2 NVMe SSD (Solid State Drive)**, typically produced by manufacturers like SK Hynix (BC series) or similar OEM suppliers for laptops and workstations. Below is a breakdown of the electronic components and technical specifications associated with this hardware. ### 1. Technical Specifications Table | Feature | Specification | | :--- | :--- | | **Form Factor** | M.2 2230 or 2280 (Small profile) | | **Interface** | PCIe Gen4 x4 | | **Protocol** | NVMe 1.4 | | **NAND Type** | 3D TLC (Triple Level Cell) | | **Capacity Options** | Commonly 256GB / 512GB / 1TB | | **Sequential Read** | Up to 5,000 MB/s (approx.) | | **Sequential Write** | Up to 4,000 MB/s (approx.) | --- ### 2. Core Electronic Components A drive with this designation consists of four primary electronic sections integrated onto a single PCB: #### A. The Controller (The "Brain") The controller manages the data flow between the host computer and the NAND storage. It handles: * **ECC (Error Correction Code):** Correcting bit errors during data retrieval. * **Wear Leveling:** Ensuring data is written evenly across the flash cells to prevent premature failure. * **Thermal Throttling:** Reducing speed if the chip exceeds safe temperatures (usually >70°C). #### B. NAND Flash Memory This is where the actual data is stored. Modern units use **176-layer or 128-layer 3D NAND**. * **Non-volatile:** Data remains stored even when the power is turned off. * **Stacking:** Multiple layers of memory cells are stacked vertically to increase density without increasing the physical size. #### C. Power Management Integrated Circuit (PMIC) Modern NVMe drives like the R1Z1 series often use integrated PMICs to: * Convert the 3.3V supplied by the M.2 slot into the specific voltages required by the NAND and Controller (usually around 1.2V or 1.8V). * Manage "Deep Sleep" states to save battery life in laptops. #### D. Passives (Capacitors and Resistors) * **MLCCs (Multi-Layer Ceramic Capacitors):** These stabilize the voltage and filter electronic noise. * **SMD Resistors:** Used for signal integrity and circuit protection. --- ### 3. Pinout and Physical Interface The **"M-Key"** connector is used for this specific part, which supports PCIe x4 lanes for maximum bandwidth. ```text M.2 Connector (Key M): [ |||||||||||||||||| | ||||| ] (75 Pins total) (Key Slot) ``` --- ### 4. Part Number Decoder (Typical) While internal OEM codes vary, the string usually breaks down as follows: * **M2:** Form factor (M.2). * **XU:** Specific series (often indicating Gen4 performance). * **R1Z1:** Hardware revision and NAND configuration. * **R/Q:** Packaging type (Reel/Bulk) or specific firmware region code. ---
    ✨ Follow-up Questions
    • What is the difference between TLC and QLC NAND in these drives?
    • Is the M2XU-R1Z1 backwards compatible with PCIe Gen3 slots?
    • Does this specific part require a heatsink for desktop installation?