The **MA71FBD-R** is a specific surface-mount electronic component, typically categorized as a **Metal Glaze Thick Film Chip Resistor**. These components are widely used in consumer electronics, industrial controls, and telecommunications due to their reliability and compact size. --- ### 1. Technical Specifications The following table outlines the general characteristics typical for the MA series of thick film resistors: | Feature | Specification (Typical) | | :--- | :--- | | **Component Type** | Thick Film Chip Resistor | | **Resistance Range** | Varies by sub-model (Check marking) | | **Tolerance** | Usually ±1% (F-grade) or ±5% (J-grade) | | **Power Rating** | 0.063W to 0.1W (Depending on case size) | | **Operating Temp** | -55°C to +155°C | | **Termination** | Sn (Tin) over Ni (Nickel) barrier | --- ### 2. Part Number Breakdown While specific manufacturers (like Panasonic, Rohm, or Yageo) have slight variations, the nomenclature generally breaks down as follows: 1. **MA**: Series prefix identifying it as a Metal Glaze/Thick Film resistor. 2. **71**: Often refers to the **0402 (1005 Metric)** or **0603 (1608 Metric)** case size, depending on the manufacturer's catalog. 3. **F**: Represents the **Tolerance**. "F" signifies a precision tolerance of **±1%**. 4. **BD**: This usually refers to the **Resistance Value** or a specific temperature coefficient (TCR) code. 5. **R**: Typically denotes **Packaging**, signifying "Reel" (Tape and Reel) for automated pick-and-place assembly. --- ### 3. Key Construction Features * **Metal Glaze Element**: The resistive element is made of a metal glaze layer on a high-grade ceramic substrate. * **Protective Coating**: A triple-layer electrode structure and an epoxy overcoat provide excellent moisture resistance and mechanical protection. * **Solderability**: The nickel barrier layer prevents "leaching" during soldering, making it suitable for both flow and reflow soldering processes. ### 4. Applications * **Mobile Devices**: Smartphones, tablets, and wearables where PCB space is limited. * **Computing**: Motherboards and peripheral high-speed data lines. * **Automotive**: Non-critical cabin electronics and infotainment systems. ---