MF1302T-R82
AI

The **MF1302T-R82** is a high-performance, surface-mount (SMD) power inductor, typically categorized within the metal composite or molded power inductor family. These components are essential for voltage regulation and energy storage in modern compact electronics.
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### ## Technical Specifications
Below is a breakdown of the key electronic characteristics for the R82 variant of the 1302 series:
| Parameter | Specification (Typical) |
| :--- | :--- |
| **Inductance** | 0.82 µH |
| **Tolerance** | ±20% |
| **DC Resistance (DCR)** | ~15 - 20 mΩ (Max) |
| **Saturation Current (Isat)** | ~7.0A - 9.0A |
| **Heat Rating Current (Irms)** | ~5.0A - 6.5A |
| **Operating Temperature** | -40°C to +125°C |
| **Case Size** | 1302 (Approx. 3.2 x 2.5 mm) |
---
### ### Key Electronic Features
1. **Metal Composite Structure**:
The core is made of a metallic iron powder. Unlike traditional ferrite cores, metal composite cores offer a "soft saturation" characteristic. This means the inductance drops gradually as current increases, rather than dropping sharply, preventing sudden circuit failure.
2. **Magnetic Shielding**:
The molded construction naturally shields the component. This reduces Electromagnetic Interference (EMI), making it ideal for high-density PCB layouts where components are packed closely together.
3. **Low DCR (DC Resistance)**:
The "R82" (0.82µH) value is optimized for high-frequency switching. The low resistance minimizes power loss due to heat, significantly increasing the efficiency of power converters.
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### ### Common Applications
The MF1302T-R82 is primarily used in **DC-DC Converters** (Buck, Boost, or Buck-Boost topologies). Specific device applications include:
* **Smartphones & Tablets**: Localized power supply for CPUs and GPUs.
* **SSD Drives**: Power management for high-speed data storage.
* **Wearables**: Small footprint allows for integration in smartwatches and IoT sensors.
* **Laptops**: Voltage Regulator Modules (VRM).
---
### ### Circuit Implementation
In a typical buck converter circuit, the inductor is placed at the output stage to smooth the current:
```spice
* Simple Buck Stage Representation
Vin ---- [Switch/MOSFET] ----+---- [MF1302T-R82 Inductor] ---- Vout
| |
[Diode/Sync FET] [Filter Cap]
| |
GND GND
```
- ⤷
What is the difference between Isat and Irms for this inductor?
- ⤷ How does the 'soft saturation' of metal composite cores benefit power supplies?
- ⤷ What are the recommended soldering profiles for the 1302 SMD package?