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  • MF1304T-R39

  • AI
    The **MF1304T-R39** is a high-current, surface-mount (SMD) power inductor commonly used in DC-DC converters, voltage regulator modules (VRMs), and high-frequency power supplies. --- ### 1. General Specifications The following table outlines the typical electrical characteristics of the MF1304T-R39: | Parameter | Specification | Unit | | :--- | :--- | :--- | | **Inductance** | 0.39 | µH | | **Tolerance** | ±20% | % | | **Saturation Current ($I_{sat}$)** | ~30.0 - 45.0 (Depends on V-drop) | A | | **Heating Current ($I_{rms}$)** | ~25.0 - 35.0 | A | | **DC Resistance (DCR)** | ~0.80 - 1.20 | mΩ | | **Operating Temperature** | -40 to +125 | °C | | **Package Size** | 13.5 x 12.8 x 4.0 (Approx) | mm | --- ### 2. Key Electronic Components & Construction The "MF" series typically utilizes advanced material science to handle high power densities: * **Core Material:** Carbonyl Iron Powder or Metal Alloy powder. This allows for "soft saturation" characteristics, meaning the inductance does not drop off abruptly when current increases. * **Winding:** Usually features a flat-wire copper winding (rectangular wire) to minimize the **Skin Effect** and reduce **DCR** (DC Resistance), which maximizes efficiency. * **Shielding:** It is a magnetically shielded construction, which minimizes Electromagnetic Interference (EMI) with neighboring components on the PCB. --- ### 3. Application Areas Due to its low inductance (0.39µH) and high current handling, it is ideal for: 1. **CPU/GPU Powering:** Multi-phase buck converters for processors. 2. **Point of Load (POL) Converters:** High-efficiency power distribution. 3. **Battery Powered Systems:** Where low heat dissipation and high efficiency are critical. 4. **Telecom & Servers:** High-current high-frequency switching environments. --- ### 4. Technical Footprint (Mechanical) ```text Dimensions (Typical): Length: 13.5 mm (+/- 0.5) Width: 12.8 mm (+/- 0.3) Height: 4.0 mm (Max) ``` ---
    ✨ Follow-up Questions
    • What is the significance of the 0.39uH inductance value in high-frequency switching?
    • How does the flat-wire construction compare to round-wire inductors?
    • What are the recommended soldering profiles for this specific SMD package?