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  • MH73FDG-R

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    Based on the identification code **MH73FDG-R**, this refers to a specific type of **NTC (Negative Temperature Coefficient) Thermistor**, typically manufactured by **Thinking Electronic Industrial Co., Ltd.** (or similar precision electronic component manufacturers). Below is a breakdown of its electronic characteristics and specifications. --- ### 1. Component Overview The MH73 series are generally **glass-encapsulated thermistors**. These are designed for high-reliability temperature sensing in environments where moisture resistance and high-temperature stability are required. | Feature | Specification Details | | :--- | :--- | | **Component Type** | NTC Thermistor | | **Encapsulation** | Glass Encapsulated (Radial Lead) | | **Resistance at 25°C ($R_{25}$)** | Typically 10kΩ to 100kΩ (Depends on sub-coding) | | **Operating Temp Range** | -40°C to +250°C (approx.) | | **Tolerance** | Usually ±1%, ±3%, or ±5% | --- ### 2. Breakdown of the Part Number While manufacturers have slight variations, the code "MH73FDG-R" generally breaks down as follows: * **MH73**: The series identifier (Glass-encapsulated, high-temperature radial type). * **F**: Often denotes the resistance tolerance (e.g., F = ±1%). * **D**: Relates to the B-constant or a specific physical dimension code. * **G**: Indicates the glass coating type or high-temperature rating. * **-R**: Typically signifies compliance with **RoHS** (Restriction of Hazardous Substances) standards. --- ### 3. Key Electronic Characteristics #### A. Temperature-Resistance Relationship As an NTC device, its resistance **decreases** as the temperature **increases**. This relationship is defined by the **B-constant**. * **High Sensitivity:** Small changes in temperature result in measurable changes in resistance. * **Stability:** The glass body protects the ceramic element from oxidation and humidity, preventing "drift" in readings over time. #### B. Thermal Properties * **Thermal Dissipation Constant:** Measures how much power causes the device to heat itself by 1°C (usually expressed in $mW/°C$). * **Thermal Time Constant:** The time it takes for the thermistor to reach 63.2% of a temperature step change (typically very fast, <5-10 seconds in air). --- ### 4. Typical Applications Due to the glass encapsulation, the MH73FDG-R is ideal for: 1. **Home Appliances:** Ovens, microwave sensors, and coffee makers. 2. **Automotive:** Oil temperature sensing or engine coolant monitoring. 3. **Industrial:** Boiler systems and chemical processing equipment. 4. **Medical:** Sterilization equipment requiring high-temperature tolerance. --- ### 5. Summary Table | Parameter | Performance Level | | :--- | :--- | | **Mechanical Strength** | High (Glass bead) | | **Moisture Resistance** | Excellent | | **Response Time** | Fast | | **Long-term Stability** | High |
    ✨ Follow-up Questions
    • What is the exact resistance value (R25) for the FDG sub-variant?
    • How does glass encapsulation compare to epoxy coating in thermistors?
    • Can this component be used in liquid immersion applications?