MHO362FAD-R
AI

The **MHO362FAD-R** is a high-performance **Oven-Controlled Crystal Oscillator (OCXO)** manufactured by MtronPTI. These components are critical in electronic systems that require extreme frequency stability and low phase noise.
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## 1. Core Technical Specifications
The following table highlights the primary electrical characteristics of the MHO362FAD-R series:
| Parameter | Specification (Typical) |
| :--- | :--- |
| **Component Type** | OCXO (Oven-Controlled Crystal Oscillator) |
| **Package Type** | DIP (Dual In-line Package) - 4 Pin / 14 Pin compatible |
| **Output Type** | CMOS / HCMOS |
| **Frequency Range** | Typically 10.000 MHz (Commonly used value) |
| **Supply Voltage (Vcc)** | +5.0 VDC (±5%) |
| **Stability (Temp)** | ±0.1 ppm to ±0.01 ppm |
| **Operating Temperature** | -40°C to +85°C (Industrial Grade) |
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## 2. Key Internal Components
An OCXO like the MHO362FAD-R consists of several specialized electronic sub-systems:
### A. The Quartz Crystal
The heart of the device. It is typically an **SC-cut (Stress-Compensated)** crystal, which offers superior aging characteristics and thermal stability compared to standard AT-cut crystals.
### B. The Heating Element (Oven)
Inside the metal casing, the crystal is placed inside a thermally insulated "oven." A resistive heating element maintains a constant internal temperature (the "turnover point"), usually around 75°C to 85°C. This prevents the frequency from drifting as the external environment changes.
### C. Temperature Control Circuitry
A feedback loop consisting of:
* **Thermistor:** Senses the internal temperature.
* **Error Amplifier:** Compares the thermistor reading to a reference voltage.
* **Power Transistor:** Adjusts the current to the heater to maintain the setpoint.
### D. Buffer/Output Stage
The electronic circuit that converts the crystal's mechanical vibration into a clean **HCMOS square wave** signal suitable for driving other digital ICs.
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## 3. Applications
Due to its high stability, the MHO362FAD-R is used in specialized sectors:
1. **Telecommunications:** Base stations (LTE/5G), small cells, and synchronization clocks.
2. **Test and Measurement:** Frequency counters and signal generators.
3. **Aerospace/Defense:** Radar systems and satellite communication ground stations.
4. **Networking:** SONET/SDH and Synchronous Ethernet.
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## 4. Pin Configuration (Typical)
While you should always consult the specific datasheet for your suffix version, the standard DIP layout is:
```markdown
Pin 1: Vc (Voltage Control / Tuning) - Optional
Pin 7: Ground (Case Ground)
Pin 8: Output (HCMOS Signal)
Pin 14: Vcc (+5.0V Power Supply)
```
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What is the difference between an OCXO like the MHO362 and a standard TCXO?
- ⤷ How do I calculate the power consumption during the 'warm-up' phase for this part?
- ⤷ Does this model support electronic frequency tuning (EFC)?