The **MPIA4020V2-R56-R** is a high-performance, automotive-grade power inductor. It is part of the MPIA4020V2 series, which is designed for applications requiring high reliability, high current handling, and a compact footprint. --- ### 1. Part Number Breakdown Understanding the alphanumeric code helps identify the component's core specifications: | Code | Meaning | Description | | :--- | :--- | :--- | | **MPIA** | Series Name | Miniature Power Inductor (Automotive Grade) | | **4020** | Case Size | ~4.0mm x 4.0mm x 2.0mm | | **V2** | Version | Version 2 (Improved materials/efficiency) | | **R56** | Inductance | **0.56 µH** (R denotes decimal point) | | **-R** | Packaging | Tape and Reel (RoHS compliant) | --- ### 2. Key Technical Specifications Below are the typical electrical characteristics for this specific inductor: | Parameter | Value | | :--- | :--- | | **Inductance** | 0.56 µH | | **Tolerance** | ±20% | | **Isat (Saturation Current)** | ~9.0 A to 11.0 A (Typical) | | **Irms (Rated Current)** | ~7.0 A to 8.5 A (Typical) | | **DCR (DC Resistance)** | ~11 mΩ to 14 mΩ (Max) | | **Operating Temperature** | -55°C to +125°C | | **AEC-Q200** | Qualified (Automotive Standard) | --- ### 3. Core Features & Benefits * **Metal Composite Core:** Unlike traditional ferrite cores, the metal powder composite core offers a "soft saturation" characteristic. This means the inductance drops gradually as current increases, rather than dropping off sharply. * **Low EMI:** The molded construction provides inherent magnetic shielding, reducing electromagnetic interference with surrounding components. * **High Power Density:** Its 4020 size (4x4mm) allows it to handle significantly higher currents than standard inductors of the same size. * **Ruggedized:** Being AEC-Q200 qualified, it is resistant to high vibration, mechanical shock, and thermal cycling. --- ### 4. Typical Applications This inductor is primarily used in DC-DC converters and power management modules (PMICs) for: 1. **Automotive Electronics:** Infotainment systems, ADAS sensors, and LED lighting drivers. 2. **Industrial Computing:** High-efficiency power supplies for compact embedded systems. 3. **Battery Powered Devices:** Where high efficiency and low heat generation are critical. ---