SDR10DSMSS
AI

The **SDR10DSMSS** refers to a high-density, stackable connector system typically used in industrial automation, robotics, and telecommunications. This specific part number is often associated with the **SDR (Standard Density Ribbon)** or high-speed board-to-board interconnect series.
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### 1. Technical Specifications
The electronics of this part are designed for high-performance signal integrity and space-saving on printed circuit boards (PCBs).
| Feature | Specification |
| :--- | :--- |
| **Connector Type** | Board-to-Board / High-Density Header |
| **Number of Positions** | 10 Pins (Typically 2 rows of 5) |
| **Mounting Type** | Surface Mount (SMT) / Stackable |
| **Pitch** | Often 0.5mm to 1.27mm (Series dependent) |
| **Plating** | Gold or Selective Gold (for oxidation resistance) |
| **Termination** | Solder |
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### 2. Key Electronic Components & Materials
* **Housing (Insulator):** Usually made of High-Temperature Thermoplastic (LCP). This allows the part to withstand reflow soldering temperatures without warping.
* **Contacts:** Phosphor Bronze or Copper Alloy. These materials are chosen for their excellent electrical conductivity and mechanical spring properties.
* **Plating:** The "SMSS" suffix often indicates a specific plating style, such as **Selective Gold** on the contact area and **Matte Tin** on the solder tails. Gold ensures low contact resistance and high durability over many mating cycles.
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### 3. Functional Applications
The SDR10DSMSS is engineered for specific electronic environments:
1. **Signal Integrity:** Designed to minimize crosstalk and impedance mismatch, making it suitable for low-voltage differential signaling (LVDS).
2. **Compact Form Factor:** The "DS" (Double Side/Dual Row) configuration allows for a high pin count in a very small PCB footprint.
3. **Mechanical Stability:** Often includes "Solder Tabs" or "Bosses" (alignment pins) to ensure the connector remains stable under vibration.
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### 4. Part Number Breakdown (Typical)
While manufacturers vary slightly, the nomenclature generally follows this logic:
* **SDR:** Series Name (Standard Density Ribbon / Stackable).
* **10:** Number of positions (10 pins).
* **D:** Dual row configuration.
* **S:** Socket/Female (or SMT style).
* **MSS:** Specific mounting/plating variation (e.g., Matte tin, Surface mount, Shrouded).
- ⤷
What is the maximum current rating per pin for the SDR series?
- ⤷ Does the SDR10DSMSS require a specific land pattern for PCB layout?
- ⤷ What is the mating cycle life for gold-plated SDR connectors?