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  • SDR10DSMSS

  • AI
    The **SDR10DSMSS** refers to a high-density, stackable connector system typically used in industrial automation, robotics, and telecommunications. This specific part number is often associated with the **SDR (Standard Density Ribbon)** or high-speed board-to-board interconnect series. --- ### 1. Technical Specifications The electronics of this part are designed for high-performance signal integrity and space-saving on printed circuit boards (PCBs). | Feature | Specification | | :--- | :--- | | **Connector Type** | Board-to-Board / High-Density Header | | **Number of Positions** | 10 Pins (Typically 2 rows of 5) | | **Mounting Type** | Surface Mount (SMT) / Stackable | | **Pitch** | Often 0.5mm to 1.27mm (Series dependent) | | **Plating** | Gold or Selective Gold (for oxidation resistance) | | **Termination** | Solder | --- ### 2. Key Electronic Components & Materials * **Housing (Insulator):** Usually made of High-Temperature Thermoplastic (LCP). This allows the part to withstand reflow soldering temperatures without warping. * **Contacts:** Phosphor Bronze or Copper Alloy. These materials are chosen for their excellent electrical conductivity and mechanical spring properties. * **Plating:** The "SMSS" suffix often indicates a specific plating style, such as **Selective Gold** on the contact area and **Matte Tin** on the solder tails. Gold ensures low contact resistance and high durability over many mating cycles. --- ### 3. Functional Applications The SDR10DSMSS is engineered for specific electronic environments: 1. **Signal Integrity:** Designed to minimize crosstalk and impedance mismatch, making it suitable for low-voltage differential signaling (LVDS). 2. **Compact Form Factor:** The "DS" (Double Side/Dual Row) configuration allows for a high pin count in a very small PCB footprint. 3. **Mechanical Stability:** Often includes "Solder Tabs" or "Bosses" (alignment pins) to ensure the connector remains stable under vibration. --- ### 4. Part Number Breakdown (Typical) While manufacturers vary slightly, the nomenclature generally follows this logic: * **SDR:** Series Name (Standard Density Ribbon / Stackable). * **10:** Number of positions (10 pins). * **D:** Dual row configuration. * **S:** Socket/Female (or SMT style). * **MSS:** Specific mounting/plating variation (e.g., Matte tin, Surface mount, Shrouded).
    ✨ Follow-up Questions
    • What is the maximum current rating per pin for the SDR series?
    • Does the SDR10DSMSS require a specific land pattern for PCB layout?
    • What is the mating cycle life for gold-plated SDR connectors?