数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

  • STM32F412RGY7

  • AI
    The **STM32F412RGY7** is a high-performance microcontroller part of the STM32F4 series, based on the Arm® Cortex®-M4 core. It is designed for applications requiring high efficiency, a small physical footprint, and robust peripheral support. --- ## 1. Core Technical Specifications The "RGY7" suffix specifically denotes the package type (WLCSP64) and temperature range. | Feature | Specification | | :--- | :--- | | **Core** | Arm® 32-bit Cortex®-M4 CPU with FPU (Floating Point Unit) | | **Max Speed** | 100 MHz | | **Flash Memory** | 1024 KB (1 MB) | | **SRAM** | 256 KB | | **Voltage Range** | 1.7 V to 3.6 V | | **Package** | WLCSP64 (Wafer Level Chip Scale Package, 64 pins) | | **Operating Temp** | -40°C to +105°C | --- ## 2. Key Internal Components ### A. Performance & Memory * **Adaptive Real-Time (ART) Accelerator:** Allows 0-wait state execution from Flash memory at up to 100 MHz. * **Batch Acquisition Mode (BAM):** An energy-saving feature that allows data transfer via peripherals (like I2C or SPI) directly to RAM while the CPU is in deep sleep. ### B. Advanced Peripherals * **Connectivity:** 4x USARTs, 5x SPIs, 4x I2Cs, and 2x CAN interfaces. * **USB:** Supports USB 2.0 full-speed device/host/OTG controller with on-chip PHY. * **SDIO:** Interface for SD cards and MMC. * **Analog-to-Digital (ADC):** One 12-bit ADC with up to 16 channels, capable of 2.4 MSPS. ### C. Timers and I/O * Includes **12 timers**: specifically two 16-bit advanced motor-control timers and several general-purpose 16-bit and 32-bit timers. * Up to **50 fast I/O ports**, most of which are 5V-tolerant. --- ## 3. Package and Physical Details (WLCSP64) The **WLCSP64** (Wafer Level Chip Scale Package) is a critical electronic aspect of this specific part number: * **Ultra-Small Footprint:** It measures approximately **3.6 x 3.6 mm**. * **Height:** Very low profile (approx. 0.6 mm), making it ideal for wearables, sensors, and space-constrained IoT devices. * **Mounting:** Uses a ball grid array (BGA) layout on the bottom of the die. --- ## 4. Part Number Breakdown: STM32F412RGY7 | Code | Meaning | | :--- | :--- | | **STM32** | Family: 32-bit Microcontroller | | **F412** | Lines: High-performance, Access line | | **R** | Pin count: 64 pins | | **G** | Flash memory size: 1024 Kbytes | | **Y** | Package: WLCSP (Wafer Level Chip Scale) | | **7** | Temperature range: -40°C to 105°C | ---
    ✨ Follow-up Questions
    • What are the power consumption benefits of the Batch Acquisition Mode (BAM) in this chip?
    • How does the ART Accelerator improve execution speed compared to standard Flash access?
    • What are the soldering challenges associated with the WLCSP64 package?