The **SWF1608LF-R82K** is a surface-mount (SMD) wire-wound chip inductor. It is commonly used in high-frequency circuits for noise suppression, filtering, and impedance matching. Below is a detailed breakdown of its specifications and electronic characteristics. --- ### 1. Part Number Breakdown Understanding the nomenclature helps identify the physical and electrical constraints of the component. | Segment | Meaning | Description | | :--- | :--- | :--- | | **SWF** | Series | Signal Wire-wound Ferrite Inductor | | **1608** | Size Code | 1.6mm x 0.8mm (EIA 0603 Package) | | **LF** | Lead-Free | RoHS Compliant / Environmental Standard | | **R82** | Inductance | 0.82 $\mu$H (Microhenries) | | **K** | Tolerance | ±10% | --- ### 2. Key Electrical Specifications Based on standard datasheets for the SWF1608 series, the **R82K** variant typically follows these parameters: | Parameter | Value | Notes | | :--- | :--- | :--- | | **Inductance** | 0.82 $\mu$H | Measured at a specific test frequency (usually 7.96 MHz) | | **Tolerance** | ±10% | The allowable deviation from the nominal inductance | | **DC Resistance (DCR)** | ~0.65 $\Omega$ (Max) | Resistance of the wire; lower is better for efficiency | | **Rated Current** | ~250 - 350 mA | The maximum current it can carry without overheating | | **SRF (Self-Resonant Freq)** | ~150 - 200 MHz | The frequency at which the part stops behaving as an inductor | | **Q-Factor** | ~15 - 20 (Min) | Quality factor indicating energy efficiency at high frequency | --- ### 3. Construction and Material * **Core Material:** Ferrite. This allows for higher inductance values in a smaller footprint compared to ceramic cores. * **Wire-wound Technology:** Unlike multilayer inductors, this part consists of a copper wire wound around a ferrite core. This construction provides: * Lower DC resistance. * Higher current handling capability. * Better stability across temperature ranges. --- ### 4. Applications This specific inductor is generally found in: * **Mobile Devices:** Filtering for RF stages and Bluetooth/Wi-Fi modules. * **Signal Processing:** High-speed signal lines to reduce EMI (Electromagnetic Interference). * **Power Management:** Small-scale DC-DC converters where space is at a premium. ---