SWI0805F-R11J
AI

## Technical Overview: SWI0805F-R11J
The **SWI0805F-R11J** is a high-frequency, wire-wound surface mount (SMD) inductor. It is commonly used in RF (Radio Frequency) circuits due to its high quality factor (Q) and stability at high frequencies.
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### 1. Part Number Breakdown
Understanding the nomenclature helps identify the physical and electrical characteristics:
| Code Segment | Meaning | Specification |
|:---|:---|:---|
| **SWI** | Series Name | Standard Wire-wound Inductor |
| **0805** | Case Size | 0805 Imperial (2.0 x 1.25 mm) |
| **F** | Material/Feature | Ferrite or Ceramic Core (Typically Ceramic for RF) |
| **R11** | Inductance Value | 0.11 µH (110 nH) |
| **J** | Tolerance | ±5% |
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### 2. Key Specifications
While specific values can vary slightly by manufacturer (such as ABC Taiwan or Viking), the standard parameters for an R11J 0805 inductor are generally:
* **Inductance:** 110 nH (nanhenries)
* **Tolerance:** ±5%
* **Case Size:** 2012 Metric / 0805 Imperial
* **DC Resistance (DCR):** Typically low (approx. 0.40 - 0.70 Ω) to minimize power loss.
* **Rated Current:** Usually ranges between 300mA to 600mA depending on the specific sub-series.
* **Self-Resonant Frequency (SRF):** High (often > 1000 MHz), making it suitable for GHz-range applications.
* **Quality Factor (Q):** High Q, providing low signal loss in resonant circuits.
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### 3. Construction and Materials
The "Wire-wound" nature of this component is its defining feature:
* **Core:** Usually a ceramic core which provides excellent thermal stability and a high SRF.
* **Winding:** Copper wire is wound around the core. This construction offers much lower DCR and higher current handling compared to multilayer chip inductors.
* **Termination:** Encapsulated with epoxy or a specialized coating for protection, with tin-plated terminals for soldering.
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### 4. Common Applications
Due to its 110nH value and 0805 form factor, it is frequently found in:
* **RF Matching Networks:** Impedance matching for antennas in Wi-Fi or Bluetooth modules.
* **Filters:** Used in Low Pass or Band Pass filters to block high-frequency noise.
* **Oscillators:** Serving as a frequency-determining element in LC circuits.
* **Mobile Communication:** Signal processing in cellular handsets and base stations.
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- ⤷
What are the main differences between wire-wound and multilayer inductors in RF design?
- ⤷ How does the 'Q factor' impact the performance of the SWI0805F-R11J?
- ⤷ Can you provide the footprint dimensions for an 0805 SMD component?