The **UP4B-101-R** is a high-performance, power inductor manufactured by **Eaton** (formerly Cooper Bussmann/Coiltronics). It is part of the Uni-Pac (UP) series, specifically designed for high-density surface mount applications. --- ### 1. General Specifications The table below outlines the primary electrical and physical characteristics of the UP4B-101-R: | Parameter | Specification | | :--- | :--- | | **Inductance** | 100 µH | | **Tolerance** | ±20% | | **Current Rating (Isat)** | ~3.3 Amps (Saturation Current) | | **Current Rating (Irms)** | ~2.5 Amps (RMS Current) | | **DC Resistance (DCR)** | ~0.101 Ohms (Maximum) | | **Operating Temperature** | -40°C to +125°C | | **Package / Case** | Surface Mount (Non-shielded) | --- ### 2. Key Features * **High Power Density:** Designed to handle significant current relative to its physical footprint. * **Robust Construction:** Features a ferrite core material with high saturation flux density, making it suitable for high-frequency applications. * **Low DCR:** The low direct current resistance ensures minimal energy loss and low heat generation during operation. * **RoHS Compliant:** The "-R" suffix indicates that the part is lead-free and meets RoHS environmental standards. --- ### 3. Common Applications The UP4B-101-R is typically used in power management circuits, including: 1. **DC-DC Converters:** Acts as an energy storage element in buck (step-down), boost (step-up), or SEPIC converters. 2. **Filtering:** Used in input/output filter circuits to reduce electromagnetic interference (EMI) and ripple voltage. 3. **Computers & Peripherals:** Found in laptop power supplies, distributed power systems, and server VRMs. 4. **Industrial Electronics:** Utilized in sensors and controllers requiring stable power delivery. --- ### 4. Technical Considerations When integrating this part into a circuit, consider the following: * **Saturation Current ($I_{sat}$):** This is the point where the inductance drops by a specific percentage (usually 10% or 30%). Do not exceed this current in peak load scenarios. * **Thermal Management:** Ensure the PCB layout provides adequate copper trace area to dissipate the heat generated by the $I_{rms}$ (heating current). * **Magnetic Shielding:** Note that the UP4B series is generally **unshielded**. If your circuit is sensitive to magnetic interference, ensure proper spacing from high-gain analog components.