## Analysis of the VLB7050HT-R15M Inductor The **VLB7050HT-R15M** is a high-performance, surface-mount (SMT) power inductor manufactured by **TDK**. It is specifically designed for high-current applications, typically used in power supply circuits for servers, networking equipment, and high-end computing. --- ### 1. Part Number Breakdown Understanding the nomenclature helps identify its physical and electrical characteristics: | Component Code | Description | Value/Detail | | :--- | :--- | :--- | | **VLB** | Series Name | TDK High Current Inductor (Wire-wound) | | **7050** | Case Size | 7.0mm x 5.0mm | | **HT** | Height/Type | High Temperature / Specific profile | | **R15** | Inductance | 0.15 µH (Microhenries) | | **M** | Tolerance | ±20% | --- ### 2. Technical Specifications The VLB series is characterized by its extremely low DC resistance and high saturation current. | Parameter | Value | | :--- | :--- | | **Inductance** | 0.15 µH | | **DC Resistance (Max)** | ~0.35 mΩ (Milliohms) | | **Rated Current (Isat)** | ~61A (Saturation current) | | **Rated Current (Itemp)** | ~40A (Temperature rise current) | | **Operating Temp** | -40°C to +125°C | | **Structure** | Ferrite core, magnetic shielded | --- ### 3. Key Electronic Features * **High Saturation Current:** The "R15" value (0.15µH) is very low, which allows the inductor to handle massive amounts of current (up to 61 Amps) before the core saturates and loses efficiency. * **Low DCR (DC Resistance):** Because the resistance is extremely low (less than 1 mΩ), the part generates very little heat even when high current passes through it, increasing overall power efficiency. * **Magnetic Shielding:** The part is shielded to prevent electromagnetic interference (EMI) from affecting surrounding components on the PCB. * **Flat Wire Design:** It often utilizes flat wire winding to maximize the copper cross-section area, further reducing resistance. --- ### 4. Typical Applications This component is usually found in **Multi-phase Buck Converters** (Voltage Regulator Modules - VRMs). 1. **CPU/GPU Power Supplies:** Used in servers and workstations where processors require 100A+ of current at low voltages. 2. **ASIC Powering:** High-speed networking chips or crypto-mining hardware. 3. **DC-DC Converters:** Point-of-Load (POL) modules for telecommunications. --- ### 5. Footprint Information ```text Dimensions (approx): L: 7.0 mm W: 5.0 mm H: 5.0 mm (Max) ``` *Note: Always refer to the official TDK datasheet for exact soldering pad dimensions and thermal derating curves.*