The **XFWICS0805-R11** is a surface-mount electronic component, specifically a **Wire-Wound Chip Inductor**. Based on the part numbering convention common in the industry, here is the detailed breakdown of its characteristics. ### 1. General Specifications The part number is structured to define the size, material, and electrical value. | Parameter | Specification | Details | | :--- | :--- | :--- | | **Component Type** | Fixed Inductor | Wire-wound technology | | **Package Size** | 0805 (Metric 2012) | 2.0mm x 1.25mm | | **Inductance Value** | 110 nH | Represented by "R11" | | **Core Material** | Ceramic | Usually used for high-frequency applications | | **Mounting Type** | SMD/SMT | Surface Mount Technology | --- ### 2. Electrical Characteristics Wire-wound inductors of this size (0805) are designed for precision and high performance in RF (Radio Frequency) circuits. * **High Q Factor:** Because it uses a wire-wound construction rather than a multilayer process, it offers a much higher Quality Factor (Q), meaning lower energy loss. * **Self-Resonant Frequency (SRF):** Ceramic core 0805 inductors typically have very high SRF, making them suitable for high-frequency filters and impedance matching. * **Current Rating:** They generally handle moderate currents (often between 150mA to 600mA depending on the specific manufacturer's DCR). * **Tolerance:** Commonly available in ±5% (J) or ±10% (K) tolerances. --- ### 3. Part Number Breakdown The nomenclature `XFWICS0805-R11` can be decoded as follows: | Segment | Meaning | Explanation | | :--- | :--- | :--- | | **XFWI** | Series/Manufacturer Prefix | Often refers to Wire-Wound Inductor series. | | **CS** | Core Material | Ceramic Substrate (High Frequency). | | **0805** | Case Size | 0.08 x 0.05 inches. | | **R11** | Inductance Value | **R** acts as a decimal point. **0.11 µH** or **110 nH**. | --- ### 4. Common Applications Due to the wire-wound nature and the ceramic core, this part is frequently found in: 1. **RF Matching Networks:** Tuning circuits in wireless communication devices. 2. **Bluetooth/Wi-Fi Modules:** Signal filtering and noise suppression. 3. **VCOs:** Voltage Controlled Oscillators. 4. **High-speed Signal Lines:** To maintain signal integrity while filtering high-frequency noise.