| 制造商 | 部件名 | 数据表 | 功能描述 |

Abracon Corporation
|
ASCSM |
1Mb/3P |
Ball Grid Array Packaging 04.24.14 |

STATS ChipPAC, Ltd.
|
FBGA |
559Kb/2P |
Fine Pitch Ball Grid Array |

Yamaichi Electronics Co...
|
IC280-169-127 |
263Kb/5P |
Ball Grid Array (FBGA / CSP / LGA) |
| NP276-11904 |
738Kb/11P |
Ball Grid Array (BGA, 1.27mm Pitch) |
| NP396-500 |
120Kb/1P |
Shrink Ball Grid Array (1.27mm Pitch) |

KOA Speer Electronics, ...
|
BR |
370Kb/2P |
ball grid array (bga) resistor networks |

Yamaichi Electronics Co...
|
IC264-22501-1 |
200Kb/1P |
Ball Grid Array (BGA, 1.50mm Pitch) |

STATS ChipPAC, Ltd.
|
FBGA-SD |
559Kb/2P |
Fine Pitch Ball Grid Array - Stacked Die |

Yamaichi Electronics Co...
|
NP291-03617 |
41Kb/1P |
Fine Ball Grid Array (FBGA, 0.75mm Pitch) |
| NP352-04808 |
563Kb/8P |
Fine Ball Grid Array (FBGA, 1.00mm Pitch) |

fujitsu semiconductor
|
BGA-320P-M06 |
34Kb/1P |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC |

List of Unclassifed Man...
|
BL1L5NT250ST1 |
94Kb/2P |
series, ball-grid-array thin film delay lines |
| FL7B5BH |
68Kb/1P |
Ball-Grid-Array Thin Film Low-Pass Filter |

Analog Devices
|
BC-148 |
276Kb/1P |
148-Lead Chip Scale Package Ball Grid Array |

IRC - a TT electronics ...
|
CHC |
1Mb/4P |
Ceramic Ball Grid Termination Arrays |
| CHC-PRECISION |
205Kb/3P |
Precision Ceramic Ball Grid Arrays |

TT Electronics.
|
CHC-CH8A-03-1002-BB |
389Kb/3P |
Precision Ceramic Ball Grid Arrays |
| CHC |
1Mb/4P |
Ceramic Ball Grid Termination Arrays |

Amkor Technology
|
ETCSP |
148Kb/2P |
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. |
| CPGA |
533Kb/1P |
Ceramic Pin Grid Array Package |