ETCSP 数据表(PDF) - Amkor Technology

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ETCSP 数据表 (PDF) - Amkor Technology

ETCSP Datasheet PDF - Amkor Technology


部件名	ETCSP

下载	ETCSP 下载

文件大小	148.67 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.

ETCSP Datasheet (PDF)

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下载数据表

ETCSP Datasheet PDF - Amkor Technology


部件名	ETCSP

下载	ETCSP Click to download

文件大小	148.67 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.

ETCSP 数据表 (HTML) - Amkor Technology

ETCSP Datasheet HTML 1Page - Amkor Technology

ETCSP Datasheet HTML 2Page - Amkor Technology

类似零件编号 - ETCSP

制造商	部件名	数据表	功能描述
Tyco Electronics	ETC-1-1-10	147Kb / 2P	E-Series RF 1:1 Transformer 1710 - 1910 MHz
Tyco Electronics	ETC-1-1-10TR	147Kb / 2P	E-Series RF 1:1 Transformer 1710 - 1910 MHz
Inventronics Inc.	ETC-150S058DT	565Kb / 9P	150W Constant Current IP67 Driver Rev. F
	ETC-150S058ST	565Kb / 9P	150W Constant Current IP67 Driver Rev. F
	ETC-150S070DT	565Kb / 9P	150W Constant Current IP67 Driver Rev. F

类似说明 - ETCSP

制造商	部件名	数据表	功能描述
STATS ChipPAC, Ltd.	FBGA	559Kb / 2P	Fine Pitch Ball Grid Array
List of Unclassifed Man...	FL7B5BH	68Kb / 1P	Ball-Grid-Array Thin Film Low-Pass Filter
Yamaichi Electronics Co...	IC264-22501-1	200Kb / 1P	Ball Grid Array (BGA, 1.50mm Pitch)
	IC280-169-127	263Kb / 5P	Ball Grid Array (FBGA / CSP / LGA)
	NP276-11904	738Kb / 11P	Ball Grid Array (BGA, 1.27mm Pitch)
	NP396-500	120Kb / 1P	Shrink Ball Grid Array (1.27mm Pitch)
ATMEL Corporation	AT34C02	496Kb / 21P	Permanent Software Write Protection for the First-half of the Array
KOA Speer Electronics, ...	BR	370Kb / 2P	ball grid array (bga) resistor networks
List of Unclassifed Man...	BL1L5NT250ST1	94Kb / 2P	series, ball-grid-array thin film delay lines
Abracon Corporation	ASCSM	1Mb / 3P	Ball Grid Array Packaging 04.24.14

关于 Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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