LAMINATE

Process Highlights

Die thickness (max)

150

Wire bonding

Standard; low loop

Die attach adhesive

Not required

Package marking

Laser

Standard Materials

Package substrate

Thin core FR5 or equivalent

Au wire

20

Encapsulant

Standard EMC

Solder balls

0.3 mm dia.

63 Sn/37Pb & SnAgCu

Top coating

Conductive epoxy (option)

Shipping

et

tape and reel if final electrical testing is performed.

Daisy Chain Availability

et

et

data sheet

With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or

damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard

terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.

www.amkor.com

(units in mm)

Package Size

Max Die Size

Max I/O (2 rows)

7 x 7

3.6

96

8 x 8

4.6

112

9 x 9

5.6

128

10 x 10

6.6

144

11 x 11

7.6

160

Configuration Options:

*Maximum die size may increase +1 mm.