| 制造商 | 部件名 | 数据表 | 功能描述 |

International Rectifier
|
IR3575 |
900Kb/23P |
60A Exposed Top Integrated PowIRstage |
| IR3575 |
955Kb/22P |
60A Exposed Top Integrated PowIRstage |
| IR3579 |
82Kb/1P |
60A Exposed-Top Integrated PowIRstage |
| IR3579A |
81Kb/1P |
60A Exposed-Top Integrated PowIRstage |
| IR3578 |
82Kb/1P |
50A Exposed-Top Integrated PowIRstage |

Advanced Power Electron...
|
AP2434GN3-HF |
94Kb/4P |
Bottom Exposed DFN |
| AP4527GN3 |
101Kb/7P |
Bottom Exposed DFN |
| AP2428GN3 |
179Kb/5P |
Bottom Exposed DFN |
| AP6970GN2-HF |
107Kb/4P |
Bottom Exposed DFN, Lower Profile |
| AP2430GN3-HF |
96Kb/4P |
Bottom Exposed DFN, Low On-resistance |
| AP4527GN3 |
101Kb/7P |
Bottom Exposed DFN, Low On-resistance |
| AP2434GN3-HF |
94Kb/4P |
Bottom Exposed DFN, Low On-resistance |

STATS ChipPAC, Ltd.
|
QFP-EP |
117Kb/2P |
Exposed Pad Quad Flat Pack |

Maxim Integrated Produc...
|
21-0109B |
35Kb/1P |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD Rev B |

Advanced Power Electron...
|
AP2428GN3 |
179Kb/5P |
Bottom Exposed DFN, Low On-resistance |

Maxim Integrated Produc...
|
21-0108 |
71Kb/2P |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD Rev K |
| 21-0111 |
31Kb/1P |
PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD Rev E |

Hirose Electric
|
GT9-12S-2.54DSA |
146Kb/5P |
Developed for Equipment Exposed to Harsh Environmental Conditions |

STATS ChipPAC, Ltd.
|
MQFP-ED |
99Kb/2P |
Exposed Drop-in Heat Slug Metric Quad Flat Pack |

Maxim Integrated Produc...
|
21-0137 |
48Kb/2P |
PACKAGE OUTLINE, 6,8,10 & 14L, TDFN, EXPOSED PAD, 3*3*0.80MM Rev J |