| 制造商 | 部件名 | 数据表 | 功能描述 |
 Maxim Integrated Produc... |
21-0109B
|
35Kb / 1P |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD
Rev B |
 NXP Semiconductors |
SOT545-3
|
15Kb / 1P |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
2004 Feb 05 |
 STATS ChipPAC, Ltd. |
LQFP
|
126Kb / 2P |
Low Profile Quad Flat Pack
|
|
MQFP
|
103Kb / 2P |
Metric Quad Flat Pack
|
|
MQFP-D
|
95Kb / 2P |
Heat Spreader Metric Quad Flat Pack
|
|
MQFP-ED
|
99Kb / 2P |
Exposed Drop-in Heat Slug Metric Quad Flat Pack
|
|
TQFP
|
92Kb / 2P |
Thin Profile Quad Flat Pack
|
|
QFP-SD
|
527Kb / 2P |
Stacked Die Quad Flat Pack
|
 Amkor Technology |
CQFP
|
332Kb / 1P |
Ceramic Quad Flat Pack Package
|
 Maxim Integrated Produc... |
21-0108
|
71Kb / 2P |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD
Rev K |