DESCRIPTION

STATS ChipPAC’s LQFP is a low profile (1.4mm) version of the QFP. The LQFP is a leadframe based, plastic encapsulated

package with gull wing shaped leads on four sides. The LQFP offers pin counts up to 208, and is suitable for designs

with high I/Os while meeting low profile requirements and for mainstream cost sensitive applications.

FEATURES

• Body Sizes: 7 x 7mm to 28 x 28mm

• Package Height: 1.4mm

• Lead Counts: 32L to 208L

• Lead Pitch: 0.80mm to 0.40mm

• Wide range of open tool leadframe and die pad sizes available

• Moisture Sensitivity: JEDEC Level 3

• JEDEC standard compliant

• Lead-free and Green materials sets available

• Copper and alloy leadframes available

APPLICATIONS

• 3D Graphics

• Multimedia

• PC Chipsets

• Video / Audio

• Telecom

• Disc Drives

• Communication Boards (Ethernet, ISDN)