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部件名	M35102

功能描述	Memory Micromodules General Information for D1, D2 and C Packaging

文件大小	277.48 Kbytes

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制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

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类似零件编号 - M35102

制造商	部件名	数据表	功能描述
STMicroelectronics	M35102	30Kb / 2P	Contactless Memory Chip with 64-bit Unique Serial ID 13.56 MHz, 2048-bit High Endurance EEPROM Oct-1999
	M35102-C20	30Kb / 2P	Contactless Memory Chip with 64-bit Unique Serial ID 13.56 MHz, 2048-bit High Endurance EEPROM Oct-1999
	M35102-C30	30Kb / 2P	Contactless Memory Chip with 64-bit Unique Serial ID 13.56 MHz, 2048-bit High Endurance EEPROM Oct-1999
	M35102-S4	30Kb / 2P	Contactless Memory Chip with 64-bit Unique Serial ID 13.56 MHz, 2048-bit High Endurance EEPROM Oct-1999
	M35102-W4	30Kb / 2P	Contactless Memory Chip with 64-bit Unique Serial ID 13.56 MHz, 2048-bit High Endurance EEPROM Oct-1999

制造商	部件名	数据表	功能描述
Texas Instruments	TPS51622ARSMR	829Kb / 10P	PACKAGING INFORMATION
Vishay Siliconix	SS23-E3	246Kb / 9P	Packaging Information 01-Feb-13
Fairchild Semiconductor	FQB44N10TM	329Kb / 2P	D2-PAK Tape and Reel Data D2-PAK Packaging Configuration: Figure 1.0
Vishay Siliconix	US1M-E35AT	396Kb / 9P	Packaging Information 05-Mar-14
Vishay Siliconix	SIHP33N60E	396Kb / 9P	Packaging Information 18-Mar-14
Torex Semiconductor	SMA-XG	76Kb / 1P	Packaging Information
	SOD-123P	173Kb / 2P	Packaging Information
	SOT-23D	229Kb / 3P	Packaging Information
	TO-252	121Kb / 2P	Packaging Information
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