| 制造商 | 部件名 | 数据表 | 功能描述 |
 NXP Semiconductors |
AN10778
|
280Kb / 14P |
PCB layout guidelines for NXP MCUs in BGA packages
Rev. 2-15 April 2011 |
 STMicroelectronics |
ST-LINK
|
87Kb / 3P |
In-circuit debugger/programmer for STM8 and STM32
06-Jan-2012 |
|
AN4503
|
334Kb / 26P |
This application note provides guidelines for successfully integrating
29-Jul-2014 |
|
AN2794
|
3Mb / 39P |
This application note provides design guidelines
13-Jan-2012 |
|
TN1198
|
140Kb / 10P |
Surface mount guidelines for MEMS sensors in HLGA packages
05-Dec-2014 |
|
AN2197
|
92Kb / 13P |
Guidelines for migrating
04-Oct-2005 |
|
AN2716
|
1Mb / 28P |
STCC08 application guidelines
16-Jun-2010 |
|
AN2860
|
268Kb / 17P |
EMC guidelines for STM8 microcontrollers
06-Nov-2012 |
|
AN3307
|
436Kb / 37P |
Guidelines for obtaining IEC 60335 Class B certification for any STM32 application
26-Apr-2013 |
|
AN3317
|
257Kb / 22P |
PCB guidelines for SPEAr1340
06-Apr-2012 |