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ISP1109 数据表 (PDF) - NXP Semiconductors

ISP1109 Datasheet PDF - NXP Semiconductors
部件名 ISP1109
下载  ISP1109 下载
文件大小   295.54 Kbytes
  59 Pages
制造商  PHILIPS [NXP Semiconductors]
网页  http://www.nxp.com
标志 PHILIPS - NXP Semiconductors
功能描述 Universal Serial Bus transceiver with carkit support

ISP1109 Datasheet (PDF)

Go To PDF Page 下载 数据表
ISP1109 Datasheet PDF - NXP Semiconductors

部件名 ISP1109
下载  ISP1109 Click to download

文件大小   295.54 Kbytes
  59 Pages
制造商  PHILIPS [NXP Semiconductors]
网页  http://www.nxp.com
标志 PHILIPS - NXP Semiconductors
功能描述 Universal Serial Bus transceiver with carkit support

ISP1109 数据表 (HTML) - NXP Semiconductors


ISP1109 产品详情

General description
The ISP1109 is a Universal Serial Bus (USB) transceiver device that supports CEA−936−A, Mini-USB Analog Carkit Interface. It is fully compliant with Universal Serial Bus Specification Rev. 2.0. The ISP1109 can transmit and receive serial data at full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) data rates.
The ISP1109 is available in HVQFN32 package.

Features
■ Fully complies with Universal Serial Bus Specification Rev. 2.0
■ Supports CEA−936−A, Mini-USB Analog Carkit Interface
■ Can transmit and receive serial data at full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) data rates
■ Supports Serial Parallel Interface (SPI) (up to 26 MHz) and I2C-bus (up to 400 kHz) serial interface to access control and status registers
■ Supports Universal Asynchronous Receiver-Transmitter (UART) pass-through on the DP and DM lines
■ Built-in analog switches to support analog audio signals multiplexed on the DP and DM lines
■ Supports On-The-Go (OTG) Session Request Protocol (SRP)
■ Supports Power-down mode, in which the whole chip consumes less than 20 µA power current
■ 3.0 V to 5.25 V power supply input range (VCC)
■ Supports wide range digital interfacing I/O voltage (VCC(I/O)) of 1.65 V to 3.6 V
■ ±12 kV ESD protection at pins DP, DM, ID, VBUS, VCC, GNDA and GNDD
■ Supports charger current switching (ISET) detection
■ Full industrial grade operation from −40 °C to +85 °C
■ Available in a small HVQFN32 (5 x 5 mm2) halogen-free and lead-free package.

Applications
■ Mobile phones.




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关于 NXP Semiconductors


NXP半导体是一家公开交易的跨国公司,设计,开发和制造各种半导体和集成电路,用于各种应用,包括汽车,工业,通信和消费市场。
该公司成立于2006年,总部位于荷兰的埃因霍温。
NXP提供了广泛的产品组合,包括微控制器,微处理器,安全身份验证IC,电源管理ICS,RF和微波炉组件以及传感器解决方案等。
该公司的产品旨在具有节能,安全和可靠,并用于各种应用中,包括汽车系统,工业自动化和控制,智能家居和建筑物以及连接的设备。
NXP致力于创新和客户满意度,并致力于为客户提供最佳的半导体解决方案,以满足他们的需求。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。




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