| 制造商 | 部件名 | 数据表 | 功能描述 |
 Maxim Integrated Produc... |
21-0146A
|
40Kb / 1P |
PACKAGE OUTLINE 52L TQFP, 10x10x1.0 MM
Rev A |
 List of Unclassifed Man... |
40-05-015
|
25Kb / 1P |
Package Outline: 48 lead 300 mil SSOP
|
 SMSC Corporation |
8SOIC
|
295Kb / 1P |
8 PIN SOIC PACKAGE OUTLINE
|
 Zetex Semiconductors |
SC70-5
|
195Kb / 3P |
Surface mounted, 5 pin package Package outline
|
 Dallas Semiconductor |
21-0110
|
55Kb / 2P |
PACKAGE OUTLINE, 32L TQFP, 5x5x1.0mm
|
 Zetex Semiconductors |
MLP322
|
176Kb / 3P |
Surface mounted, 3 pin package Package outline
|
|
SOD523
|
177Kb / 3P |
Surface mounted, 2 pin package Package outline
|
 MUSIC Semiconductors |
MU9C1480L
|
56Kb / 2P |
TQFP Package Option
|
 Zetex Semiconductors |
TO92
|
87Kb / 2P |
Through hole, 3 pin package Package outline
|
 Future Technology Devic... |
NERO-NP1
|
820Kb / 18P |
16MHz ATmega328 32-pin TQFP package microcontroller.
|