Description

The IRF6645 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET™ packaging to achieve the lowest on-state resistance in a package that has the footprint of an Micro8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.

 RoHs Compliant Containing No Lead and Bromide

 Low Profile (<0.7 mm)

 Dual Sided Cooling Compatible

 Ultra Low Package Inductance

 Optimized for High Frequency Switching

 Ideal for High Performance Isolated Converter Primary Switch Socket

 Optimized for Synchronous Rectification

 Low Conduction Losses

 Compatible with existing Surface Mount Techniques