| 制造商 | 部件名 | 数据表 | 功能描述 |
 NXP Semiconductors |
BGB203
|
1Mb / 24P |
Bluetooth System-in-a-Package radio with baseband controller
Rev. 1.0-2005 July 28 |
 SynQor Worldwide Headqu... |
NQ04T33VKA10
|
798Kb / 18P |
SIP Single In-Line Package
|
 ON Semiconductor |
ULPMC10
|
159Kb / 19P |
Struix System-in-Package
July, 2015 ??Rev. 4 |
 MORNSUN Science& Techno... |
G0505S-2WR2
|
1Mb / 5P |
SIP package
|
 Recom International Pow... |
RS6
|
402Kb / 7P |
Highest Power Density In SIP Package
|
 Cypress Semiconductor |
CYW20737S
|
1Mb / 24P |
Bluetooth Low Energy System-in-Package (SiP) Module
|
|
CYW20737L
|
1Mb / 24P |
Bluetooth Low Energy System in Package (SiP) Module
|
 ON Semiconductor |
RSL10
|
158Kb / 19P |
Bluetooth 5 Radio System-on-Chip (SoC)
May, 2018 ??Rev. 3 |
 List of Unclassifed Man... |
BNO080
|
1Mb / 57P |
The BNO080 is a System in Package (SiP) that integrates a triaxial accelerometer
|
 silex technology americ... |
SX-SDPAC
|
1Mb / 1P |
802.11a/b/g/n/ac plus Bluetooth SDIO System-in-Package (SiP) Module
REV D 20200327 |