Description
The OP906 device consists of a PIN silicon photodiode molded in a clear epoxy package which allows spectral response from visible to infrared light wavelengths. The narrow receiving angle provides excellent on-axis coupling. These devices are 100% production tested using infrared light for close correlation with Optek’s GaAs and GaAlAs emitters. Lead spacing is 0.100 inch (2.54 mm).

Features
·Narrow receiving angle
·Linear response vs irradiance
·Fast switching time
·T-1 package style
·Small package ideal for space limited applications

Absolute Maximum Ratings (TA = 25℃ unless other wise noted)
Reverse Breakdown Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 V
Storage and Operating Temperature Range . . . . . . . . . . . . . . . . . . -40℃ to +100℃
Lead Soldering Temperature [1/16 inch (1.6 mm) from case for 5 sec. with soldering iron] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260℃
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mW